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SUPPLEMENT THE INTERNET OF THINGS PARTNERSHIP AGREEMENT TO MANUFACTURE SOFTBATTERY Molex has signed a worldwide licenced agreement to manufacture Enfucell
SoftBattery power sources. With over a decade developing the patented technology, Enfucell has been a
forerunner in printable battery design for the needs of healthcare, sports and logistics. The non-exclusive partnership allows Molex to better serve rapidly growing markets for wearable and Internet of Things (IoT) electronics products and sensor applications powered by printable batteries. “The IoT is proving a powerful tool in ‘smart’ solutions. Demand is on the rise
for affordable power sources to support connectivity in sensors, patches, wearables and other intelligent applications,” states John Heitzinger, industry marketing manager, Molex. Sensors and other Internet-enabled solutions need power to function. Many
wearable applications such as sports devices or skin patches for medicinal delivery require power sources with resilient features. The high quality battery is a flexible, all-print primary solution manufactured of low-cost industrial eco-friendly materials based on zinc and manganese dioxide, with zinc chloride as an electrolyte. Printed electronics differ from traditional electronics in that power sources and
other components can be fabricated on flexible substrates. Molex manufactures electronic, electrical and fibre optic solutions, and brings expertise in printed and flexible electronics, including a proprietary roll-to-roll printing process for affordable production. The innovative battery technology allows for a wide range of customised sizes
and shapes to be manufactured and integrated into products they power. Under the terms of the agreement, Molex now provides end-to-end project support and printed manufacture of SoftBattery power sources to label, patch and other device types. Heitzinger adds: “From design to prototyping to full-scale manufacturing,
Molex expertise and advanced manufacturing processes provide significant advantages for customers to create solutions that leverage the benefits of the IoT and are powered by printed batteries.”
www.molex.com
LOGIC PACKAGE FOR PORTABLE DEVICES
A small leadless logic package for 8 lead logic functions has been released by NXP Semiconductors. Measuring just 0.8mm x 1.35mm and only 0.35mm in height, the GX 8 (SOT1233) package is especially suitable for mobile, portable and IoT applications as it not only saves space and has a more rugged design. NXP’s logic devices are used to provide the interface between the different
ASICs and with this newintroduction, most AXP, AUP and LVC functions are now available in a GX package, addressing designers’ needs for the largest spectrum of standard logic functions in the smallest package possible. The company’s logic devices are used to interface between the different ASICs and with this new introduction, most AXP, AUP and LVC functions are now available in a GX package.
ww.nxp.com/logic
TWO NEW LOW-POWER WIRELESS MODULES
compliant transceiver modules interface with Microchip PIC32 microcontrollers and are supported by the company’s MPLAB Harmony integrated software framework with a TCP/IP stack. The Microchip MRF24WN0MA
Mouser Electronics, Inc. is now stocking the MRF24WN0MA and MRF24WN0MB wireless modules from Microchip. The low-power, 2.4GHz, IEEE 802.11b/g/n-
and MRF24WN0MB wireless modules, offer a range up to 300 meters with low current consumption that is specified at 64mA (typical) in Receive (RX) mode and 246mA at 18dBm (typical) in Transmit (TX) mode
www.mouser.com
/ ELECTRONICS
ELECTRONICS | DECEMBER/JANUARY 2017 S5
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