Jetting fluids in non-traditional packaging and assembly applications
Figure 2: Reagent dispensed onto each die in wafer
Inner
limit
Outer
limit
Target
diameter
Bead Material
(Dispensed first)
I-Guard Material
(Dispensed on top of
bead material)
1 mm
Figure 2. Reagent dispensed onto each die in wafer.
Figure 3: Yellow phosphor jet dispensed on LED
analysis circuits
Panel sizes Size (mm) The 7th Generation
that need to have
chemicals jetted
G1 320 x 400
1,900 x 2,200 mm
into wells as part of G2 410 x 520 The 6th Generation
the circuits’ future 1,500 x 1,850 mm
G3 650 x 830
function in the end
device (Figure 2). G4 730 x 920
The discovery
The 5th Generation
G5 1300 x 1500
of the blue LED
1,100 x 1,250 mm
has exploded into
G6 1500 x 1850
a huge market for
G7 1950 x 2250
high brightness
Figure 3. Yellow phosphor jet dispensed on LED.
white LEDs. LEDs
G8 2160 x 2400
will help reduce G9 2400 x 2800
energy requirements mm), fast and low
and provide new innovative products in power screens in
Figure 4. Glass sizes for LC FPD panels.
lighting for the automotive, industrial and the future. Cur-
general lighting markets. In the packaging rently AMOLED
there is not yet convergence on technolo-
of the LEDs, a yellow phosphor (typically is limited to G4 sizes. Dispensing is used
gies and chip layout design rules.
YAG) must be applied uniformly over on seals for the encapsulation glass. And
In the interim, multiple chip stacking
the die to create a white light. The CIE for top emission devices, a polarizing &
is accomplished by wire bonding and face
value of the light varies from blue to yel- light guide adhesive must be dispensed by
to face flip chip technologies. Wire bond-
low depending upon the phosphor, % of one drop fill (ODF) between the diode and
ing is a known technology, with known
phosphor, distribution over the die and cover glass. A new application for FPD is
processes and a large capital infrastructure
other factors8. Jetting and other dispensing the post module assembly process of ap-
at the packaging houses. This position
processes are used to apply phosphor filled plying a polarizing film. The film captures
provides a known cost of ownership and
silicones, bond phosphor carrier plates incident light and allows excellent visibility
low process risk. However, wire bonding
to the die, underfill die, and create lenses of screens in full sunlight
9
.
multiple chips has the disadvantage that
(Figure 3).
at each chip level there is a probability of
The display industry is seeing the thin emerging application: 3D intercon-
failure during assembly. This means that
film transistor (TFT) liquid crystal (LC) nect
the value of interconnecting the lower
flat panel displays (FPD) become a mature As the need for miniaturizing packaging
levels is lost at the point of failure in the
industry. As in PV, the front end FPD pro- continues, the industry is being driven to
serial assembly process (Figure 6).
cesses use many of the front end semicon- 3D packaging (Figure 5).
A new jetting technology provides
ductor equipment sets, but on much larger Package on package (PoP) has become
an interconnection process that is more
scales. A generation eight production line mainstream for increasing a system’s
reliable and cost effective. By jetting silver
handles a substrate that is 2160 x 2400 mm memory. The industry is driving toward
epoxy along the edge of the stacked die,
(Figure 4). 3D stacking at the wafer level with the
interconnection is made between all die in
New display technologies are emerging emergence of through silicon via (TSV)
the stack (Figure 7).
that will replace the LC displays. Ac- interconnections. However, wide com-
One example of this process is pro-
tive matrix organic light emitting diodes mercialization of TSV is probably five years
vided by Vertical Circuits Inc. (VCI). On a
(AMOLED) promise bright, thin (<1 away. Currently TSV is too costly, and
memory package that required eight
www.globalsmt.net Global SMT & Packaging – May 2009 – 15
Page 1  |  Page 2  |  Page 3  |  Page 4  |  Page 5  |  Page 6  |  Page 7  |  Page 8  |  Page 9  |  Page 10  |  Page 11  |  Page 12  |  Page 13  |  Page 14  |  Page 15  |  Page 16  |  Page 17  |  Page 18  |  Page 19  |  Page 20  |  Page 21  |  Page 22  |  Page 23  |  Page 24  |  Page 25  |  Page 26  |  Page 27  |  Page 28  |  Page 29  |  Page 30  |  Page 31  |  Page 32  |  Page 33  |  Page 34  |  Page 35  |  Page 36  |  Page 37  |  Page 38  |  Page 39  |  Page 40  |  Page 41  |  Page 42  |  Page 43  |  Page 44  |  Page 45  |  Page 46  |  Page 47  |  Page 48  |  Page 49  |  Page 50  |  Page 51  |  Page 52