Jetting fluids in non-traditional packaging and assembly applications
Jetting fluids in
non-traditional packaging
and assembly applications
by Alec J. Babiarz, Asymtek, Carlsbad, CA, USA
introduction
the PV wafers are uniformly sprayed with a
The expansion of business The electronics packaging and assembly
phosphor doping material prior to entering
into alternative energy, green
industry is being affected in a positive man-
the doping furnace. Later in the line, the
components and energy-efficient
ner as more business develops from green
PV wafers must have conductive collector
components is having a signifi-
initiatives, alternative energy, higher energy
lines applied across the cell that are bussed
cant impact on the electronics
efficiency requirements and the emergence
together on each cell and then stitched
and semiconductor industry.
of life science applications. There are
between cells to form a panel (Figure 1).
challenges in developing alternate energy
In solar cell production using
The conductive collector lines are applied
sources, higher power density, small size,
wafers or printed electronics, the
by stencil printing, electroplating from seed
low cost and the durability and reliability
lines or dispensing.
application of fluids to the end
required by life science applications. Non
Over the last several years, underfilled
product is part of the function
contact jetting, spraying and film coating
flip chip dies and packages have been used
of the product rather than just processes are utilized to enable the function
in life science applications such as pace
a packaging process. Energy of semiconductor devices by being part of
makers and hearing aids to reduce size and
efficient lighting using LEDs
the end product’s structure or operation
power while increasing capability and reli-
depends upon the function and
rather than just a package.
ability. Jetting the underfill allowed smaller
proper deposition of phosphor-
keep-out zones around the dies, enabling
filled silicones. Fuel cell proton
recent applications
tighter packaging. Currently, the emerging
exchange membrane manufac-
Photovoltaic (PV) solar cells utilize several
life science applications are in blood analy-
dispensing processes from the initial pro-
turing depends upon fine and
sis. In these applications, the semiconduc-
duction stages to the final assembly of com-
uniform film builds of carbon
tor wafers have specialty die that are fluid
plete panels. Beginning in the first stages,
platinum dispersions and nafion
using jet spraying technologies.
Some new fuel cell technologies
are being developed directly on
silicon wafers for mobile power
applications. As the industry
continues to move to more green
.4;;).,$;)2)>%9)36"%)
focused manufacturing, new ma- *+"?4'9+$)9$,'%;)
terials and processes are being
introduced to mitigate the high
price of gold wire bonding. Jet-
ting of a wide range of materials
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has enabled the advancement of
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these new products.
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Keywords: Jet, Underfill, Fuel
Cells, Stacked Die, ODF, FPD
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This paper was originally presented at the
'4$$%"9):$+'%;;)2)8'$%%")<$6"9)2)8:$,=),::36',#+")
PanPacific Microelectronics Symposium,
Figure 1. Dispensing processes on PV wafer.
Hawaii, USA, February 2009.
14 – Global SMT & Packaging – May 2009 www.globalsmt.net
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