TitleAssociation & institutes news
Association & institutes news
of dimensional attributes of IPC-approved should be original, unpublished and non-
land patterns. commercial in nature.
IPC members and nonmembers who Papers are sought in the following key
own IPC-7351A can download the LP Cal- technology tracks:
culator free at
http://landpatterns.ipc.org/.
• Assembly
IPC releases 2007-2008 industry
The standard is also available for purchase
• Business
forecasts
through IPC’s online bookstore at www.
• Components
North America 2007-2008 Flexible Circuit
ipc.org/onlinestore in hard copy, on CD
• Emerging Technologies
Industry Analysis and Forecast
or by download. To order by phone, call +1
• Harsh Environment Applications
Survey-based study presents data and
847-597-2862.
• PCB Technology
analysis on trends in the North American
• Process Control
flexible circuit industry, including growth
IPC invites industry, academics
estimates and sales history, number of fab-
to submit poster abstracts for IPC
Abstracts (300 words) are due March 27,
ricators, global footprint of North Ameri-
APEX EXPO in Las Vegas
2009. Proposals are also solicited from in-
can fabricators, trends in materials, sales by
IPC invites researchers, academics,
dividuals interested in teaching educational
product type, production mix (high-volume
technical experts and industry leaders to
courses related to surface mount technol-
vs. quick-turn vs. prototype), trends in line
submit abstracts for poster presentations
ogy, advanced packaging, and electronics
width and spacing, revenue trends from
at IPC APEX EXPO™, to be held March
manufacturing. Course length may be half-
value-added services, industry end-markets
31-April 2, 2009, at the Mandalay Bay
day or full-day, and these proposals must
by product type, and U.S. imports and
Resort & Convention Center, Las Vegas.
also be submitted by March 27, 2009.
exports. Survey sample of five companies
Poster presentations offer a stellar oppor-
As speakers and participants make
represents 81% of North American flexible
tunity to gain significant visibility from key
contributions to the industry and are
circuit production. 41 total pages. Released
engineers, managers and executives in all
recognized by colleagues in sharing research
November 2008.
segments of the electronic interconnection
work and findings. To reward exceptional
industry.
achievement, $1,000 and a recognition
2007-2008 Industry Analysis and Forecast
Expert poster presentations are being
plaque are given for the “Best of Confer-
for Rigid PCBs in North America
sought on all relevant electronics topics.
ence Presentation,” “Best of Proceedings
Survey-based study presents data and analy-
Submissions in the areas of new materials
Paper,” and “Best International Paper.”
sis on trends in the North American rigid
and environmental concerns are especially
Abstracts can be submitted directly
PCB industry, including industry growth
encouraged. An abstract of up to 300
on-line from the SMTA International event
forecast, industry end-markets served, sales
words summarizing technical and previ-
website:
www.smta.org/smtai/call_for_papers.
history by product type, trends in high-
ously unpublished, non-commercial work
cfm or to SMTA Executive Administrator
density multilayer boards, production mix
covering case histories, research and discov-
JoAnn Stromberg:
joann@smta.org or 952-
trends (high-volume vs. quick-turn vs pro-
eries should be sent to Toya Richardson,
920-7682.
totype), number and average value of PCBs
IPC technical administrative assistant, at
and panels produced, and US imports and
ToyaRichardson@ipc.org by January 30,
2009 International Wafer-Level
exports. Survey sample of 12 companies
2009.
www.IPCAPEXEXPO.org
Packaging Conference dates and
represents about 31% of the rigid PCB
location announced
industry in North America. 50 total pages.
The 2009 International Wafer-Level Packag-
Released November 2008.
ing Conference, coordinated by the SMTA
and Chip Scale Review Magazine, will be
IPC enhances IPC-7351A with free
held on October 27-30, 2009 at the Santa
land-pattern calculator
Clara Marriott in Santa Clara, California.
In a move that will help PCB designers
SMTA International issues 2009 call The Santa Clara locoation allows or an
work with greater accuracy and efficiency,
for papers additional conference track and increased
IPC—Association Connecting Electron-
Industry professionals are invited to submit space for the tabletop exhibition.
ics Industries® has partnered with PCB
a paper for SMTA International 2009, the The IWLPC will have two days of half-
Matrix Corp. to include a free land pat-
electronic industry’s premier conference on day tutorials led by leading instructors in
tern calculator with IPC-7351A, Generic
the manufacture of electronic products and the industry, followed by two days contain-
Requirements for Surface Mount Design
related business practices. This year’s event ing three tracks of technical presentations
and Land Pattern Standard. Because the
will be held October 4 to 8, 2009 at the on wafer-level packaging technologies, 3D
mathematical algorithms from IPC-7531A
Town and Country Resort and Convention and Advanced Packaging and a tabletop
are built into the LP Calculator, designers
Center in San Diego, CA. exhibition.
can build a land pattern for a correspond-
Papers should describe significant Visit
www.iwlpc.com for more informa-
ing surface mount part quickly and accu-
results from experiments, emphasize new tion on the 2009 program.
rately. The tool also allows for modification
techniques, and contain technical, eco-
nomic or appropriate test data. Materials
46 – Global SMT & Packaging – January 2009
www.globalsmt.net
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