PCB layout and soldering nozzle design in selective soldering processes
plate. Any splashes, and basic knowledge about the process
which might occur itself and involved materials.
while the liquid sol- Up-to-date selective soldering systems, how-
der is flowing back ever, already take out most of the difficul-
to the reservoir, will ties that could arise during the process.
not get a chance to With some basic board design rules being
touch the printed considered, time-consuming and cost
circuit board. intensive repair soldering are a thing of the
past with simultaneously increasing quality
conclusion level of the manufactured products.
Among all auto-
mated soldering Reiner Zoch is product manager, selective
processes, selective soldering, for SEHO Systems in Kreuzwertheim,
soldering is probably Germany.
the most demanding
process, requiring
Figure 11. Avoid solder resist close to the solder joint.
some experience
Electrostatic discharge (ESD) and automated handling processes, continued from page 14
conclusion
5. IEC 61340-5-2, Electrostatics - 08.2007: 12. International Technology Roadmap
These experiences make the search for
Part 5: Specification for the protection for Semiconductors (ITRS), Factory
suitable solutions and further analysis of
of electronic devices, from electrostatic Integration, Update 2005
the processes easier. They were collected
phenomena, Section 2: User guide 13. D. G. Bellmore, ESD and Mechani-
through adequate measurement con-
6. ANSI/ESD S20.20-2007 ESD Associa- cal Design, Universal Instruments
structions. Future analyses will support
tion standards for the Development Corporation
these experiences and will lead to precise
of an Electrostatic Discharge, Control 14. D. G. Bellmore, Characterizing Au-
measurement constructions. First of all,
Program for – Protection of Electrical tomated Handling Equipment Using
the record of the real electrostatic charges
and Electronic Parts, Assemblies and Discharge Current Measurements Part
and electrostatic fields is necessary. Start-
Equipments II, 27. EOS/ESD Symposium 2005,
ing from these experiences, meaningful
7. ESD SP10.1-2000, ESD Association Anaheim, CA
solutions for the avoidance of electrostatic
standard practice for Protection of
charges, potential differences and fields
Electrostatic Discharge Susceptible Hartmut Berndt will be giving a professional
can develop.
Items – Automated Handling Equip- development course on “Electrostatic Discharge
ment (AHE) (ESD), Factory Issues and Product Quality” on
references
8. H. Berndt, Five Steps for an ESD March 30, 2009, at IPC APEX EXPO. For
1. H. Berndt, Five Steps for the Intro-
control system – ESD control and more information visit www.goipcshows.org.
duction of an ESD Control System,
machines, measurement methods,
Proceedings APEX 2004, Anaheim,
Proceedings APEX 2005, Anaheim, Hartmut Berndt is the founder of B.E.STAT
CA, U.S.A.
CA, U.S.A. and has more than 27 years of experience in
2. H. Berndt, A study of the Variables of
9. A. Olney, B. Gifford, J. Guravage, A. ESD and electronic devices. Prior to B.E.STAT,
Electrodes used in the Measurement
Righter, Real-World Charged Board Berndt worked in semiconductor development at
of Table and Floor Materials and How
Model (CBM) Failures, 25. EOS/ESD Zentrum Mikroelektronik in Dresden, Germany.
They Affect the Test Results, 23. EOS/
Symposium 2003, Las Vegas, NV He is a member of the ESD Association and
ESD-Symposium 2001, Portland, OR
10. JEDEC Standard JESD22-C101-A, the Electrostatic Society of America, and
3. H. Berndt, VDE-Schriftenreihe - Nor-
Field Induced Charged Device works as an expert on national and interna-
men verständlich - Band 71 Elektrosta-
Model Test Method for Electrostatic- tional standard committees. Since 2002, he
tik - Ursachen, Wirkungen, Schutz-
Discharge-Withstand; Thresholds of has served as secretary of the IEC TC 101:
maßnahmen, Messungen, Prüfungen,
Microelectronic Components, June, Electrostatics and actively participates in the
Normung, VDE-Verlag, 2. Edition,
2000 development of IEC’s current and future ESD
2005
11. D.L. Lin, FCBM – A Field-Induced standards. Berndt holds a Dipl.-Ing. degree in
4. IEC 61340-5-1, Electrostatics - 08.2007:
Charged-Board Model for Electrostatic physics and semiconductor technology from the
Part 5: Specification for the protection
Discharges,” IEEE Transactions on Technical University of Karl Marx Stadt (today
of electronic devices from electro-
Industry Applications, Vol. 29, No. 6, Chemnitz) in Germany. Contact Mr. Berndt at
static phenomena, Section 1: General
pp. 1047-1052, November/December hberndt@bestat-esd.com.
requirements
1993.
www.globalsmt.net Global SMT & Packaging – January 2009 – 19
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