2009: Very little smooth sailing until at least summer
workforce) in early 2009. Europe. rials Business unit.
• former VP and controller Bryan Meier Cognex appointed Thomas Nash president KLA-Tencor plans to cut its work force by
was appointed VP of finance and chief of its Surface Inspection Systems division. 15% by the end of June, 2009.
accounting officer of VeraSun. Dow Chemical named Pierre Brondeau Lincoln International:
WYTAN and View Systems merged. head of Rohm and Haas Advanced Materi- • completed 12 M&A transactions be-
Z-AXIS added a YESTech AOI system in als division. tween September 1st and October 31st,
Phelps, NY. Dover named Robert Livingston CEO. despite a challenging market.
Enthone (Cookson Electronics) appointed • represented ACT Electronics in the
Materials & process equipment Ben Poon Sr. VP and managing director of sale of its Mississippi division to CDR
A.C.E. Production Technologies estab- Enthone Asia. Manufacturing.
lished a selective soldering development Essemtec: Mania Belgium (formerly Barco ETS) was
lab in Spokane, Washington. • developed a system to dispense and renamed Ucamco.
Atotech opened a new European TechCen- place in three dimensions, targeting Manncorp introduced an ‘advanced
ter for corrosion protection applications 3D-MID technology. starter’ turnkey line targeted for prototyp-
in Trebur, Germany, and plans to open ad- • named OSTEC Enterprise its Russian ing & low-volume assembly.
ditional TechCenters in Taiwan, the Czech distributer. Omron Electronics introduced its Xpectia
Republic, India and Italy in 2009. FCT Asia named Electroloy Metal its flexible vision system.
Carl Zeiss set new record resolution bench- distributor in Hong Kong and China. Orbotech:
mark of 2.4 Angstrom (0.24 nanometer) Fine Line Stencil opened its Memphis, • cut 150 employees.
for scanning electron and ion microscopy. Tennessee, stencil manufacturing facility • sold its European and US electronics
Cobar: and added a LPKF MultiCut laser. PCB assembly equipment business to
• celebrated its 25th anniversary of its Heraeus appointed Frank Murch direc- Fin.Pro S.p.A.
founding in Breda, Holland. tor of sales & marketing and Roy Baumer
• promoted Manfred Bult to COO in operations manager for its Assembly Mate-
Continued on page 42
20081211 20081208
Taiwan Shipments
World PCB Shipments
27 Rigid PCB & 8 Laminate Manufacturers Converted @ Constant 2007 Exchange Rates
PCB - NT$ (billions) Laminate - NT$ (millions) $ Billion
3500 60
24
PCB Laminate
Assumptions:
Europe monthly ratio = SIA European semiconductor ratio
Japan & N. America from JPCA & IPC data
21
3000
Taiwan/China based upon 28 large company composite
Rest of Asia growth = Taiwan/China composite
18
50 Data scaled to match Henderson Ventures annual totals
2500
2007 based upon sum of monthly totals
15
2000
12
40 Nov
1500
estimate
based on
9
partial
1000 data
6 30
3
500
40.7 32.9 33.3 34.5 39.9
44.4 49.6 51.9
0 0 20
1 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 911
1 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 911
01 02 03 04 05 06 07 08 99 00 01 02 03 04 05 06 07 08
CALENDAR YEAR
CALENDAR YEAR
Company Financial Releases
Source: Custer Consulting Group - synthesized from Henderson Ventures annual estimates and N.
American, Japanese & Taiwan/China monthly PCB shipments and SIA European chip shipments
Chart 9. Chart 10.
20081213 20081207
World Electronic Equipment, PCB &
Electronic Equipment Production Growth
Semiconductor Shipments Current $ Growth Rates Converted @ Constant 2007 Exchange Rates
Converted @ Constant 2006 Exchange Rates
3/12 rate of change
2006 2007 2008 2009 2010
1.5
PCB "0" Growth SIA El Equip World 10.1 8.1 1.2 1.3 3.3
1.3 USA 7.5 0.9 -0.1 -4.4 4.3
1.1
W Europe 0.7 -0.1 0.5 -6.0 3.8
0.9
Assumptions:
Japan 3.9 0.2 -8.5 -5.3 4.6
Europe monthly ratio = SIA European semiconductor ratio
Japan & N. Americas from JPCA & IPC data
0.7 Taiwan/China based upon 28 large company composite
Rest of Asia growth = Taiwan/China composite
Four Tigers 10.6 7.6 2.8 -4.1 5.4
Data scaled to match Henderson Ventures annual totals
0.5
3 6 9 12 3 6 9 12 3 6 9 12 3 6 9 12 3 6 9 12 3 6 9 12 3 6 9 12 3 6 9 12 3 6 9 12
China 20.7 21.2 5.1 2.3 10.1
00 01 02 03 04 05 06 07 08
CALENDAR YEAR
Henderson Ventures 12/2008
Source: Custer Consulting Group & Henderson Ventures
www.hendersonventures.com
Chart 11. Chart 12.
www.globalsmt.net Global SMT & Packaging – January 2009 – 31
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