Hall A3, Stand 139/1 Hall B1, Stand 441
Zytronic reveals the future of touch technology – and it's curved
Z
ytronic will be showcasing applications at electronica that demonstrate what is possible at the limit of touch screen technology and give an insight into emerging trends for human-machine interfaces. The company is set to focus on curved screens. The centrepiece of the stand will be a proof- of-concept kiosk incorporating a concave 40-inch multi-touch screen. A waist height 19-inch 'Qwerty' touchscreen keyboard has also been included on the same 'zero bezel' printed glass interface, with the two touch sensors managed by a pair of Zytronic ZXY200 controllers managed by a single PC. Zytronic is also demonstrating the newest addition to its
proprietary MPCT multi-touch projected capacitive product portfolio, the ZXY300, a touch controller that enables significant improvements in operational performance on ultra- large format MPCT touchscreens (above 55-inches in size). By combining innovative electronic design with updated
firmware containing its latest touch detection algorithms, the ZXY300 can boost the density of touch data captured by the screen, significantly increasing touch resolution, whilst still maintaining millisecond response times. With the addition of the ZXY300 controller, the complete range of MPCT sensor sizes currently available have the capacity to support up to 40 simultaneous touch points with a touch separation of less than 10mm between each point (i.e. less than the width of a fingertip).
Zytronic |
www.zytronic.co.uk
POLYRACK TECH to highlight latest casing and system solutions
T
he POLYRACK TECH-GROUP will be presenting its wide range of innovative case and system solutions as well as panel PCs for HMI / MMI applications at this year's event.
In addition to application-specific system solutions, highlights include the new
industrial PC 2 series as well as the rugged MIL 1/2 short ATR chassis for rough conditions; a system platform that will be presented for the first time at electronica. For the IPC 2 series, POLYRACK has completely redesigned its successful industrial PC series to provide an easy assembly and greater flexibility in front design. With its new rugged MIL 1/2 short ATR chassis, POLYRACK is presenting a heavy-duty, passively cooled case platform for tough mechanical, climate, chemical and electrical environments. The case is designed to conform to specifications in safety and defence technology. It can also be configured using CPCI, VME, VMEX, VPX backplanes and OpenVPX, as well as power supply units and I/O connection cards. As a further innovation, POLYRACK will be demonstrating its expanded backplane collection to include standards such as VPX and CompactPCI serial. POLYRACK's EmbedTEC case series provides a casing solution that can be altered in almost all its dimensions. Primarily developed for embedded computing and HMI (human machine interface), EmbedTEC can also be used in other fields of application.
POLYRACK TECH-GROUP |
www.polyrack.com
CIE electronica 2014
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