Laser Marking


By Daniel R. Gold, President and Founder—LNA Laser Technology, and Dale A. Sabo, Vice President Sales & Marketing—SCANLAB America Inc.


Laser marking or engraving remains one of the largest laser application segments in terms of units sold and revenue. Almost all items manufactured today need to be marked for traceability or brand- ing and the process is used across a wide range of industries: medical devices, automotive, aerospace, defense, electronics, semiconduc- tor, industrial tools, firearms and jewelry.


Lasers used for marking can


range in the wavelength spectrum from UV (355 nm) to far infrared (10,600 nm), depending on the material and application require- ments. The majority of lasers used for marking in manufacturing fall in the infrared 1 micron (1064 nm) or the far infrared (10,600 nm). The choice is mainly material driven. One micron infrared (1064-nm) lasers, either DPSS (diode-pumped solid state) or fiber laser technology, are used to mark mainly metals and many plastics, whereas far infrared (10,600 nm) CO2 lasers are used to process mainly organic materials such as wood, leather, glass, foam, stone and plastic engraving. The shorter wavelengths such as Green (532 nm) and UV (355 nm) are reserved for applications requiring


high material absorption and low impact on the material (such as heat affected zone, recast, etc.). Short wavelength marking applications include solar panels, computer hard disk components, semicon-


The future of advanced 2D & 3D laser processing is here.


Building on the possibilities of fiber laser technology for cutting, welding, and drilling, Laserdyne has developed a versatile, small foot print system. The new LASERDYNE 430 laser system is a multi-axis laser system offered in the following configurations for processing 2D and 3D parts: 3 axis, 4 axis, 5 axis with the unique LASERDYNE BeamDirector®


and 6 axis with a BeamDirector


and rotary table. See it in action at booth E-5139 or learn more call 763.433.3700


Features include: •BeamDirector for 3D beam delivery •Optical Focus Control (OFC®


•BreakThough Detection (BTD®) •Hole diameter compensation (HDC® •Shaped hole software •SPC data acquistion and so much more.


) •Hole drilling program creation (CylPerf® )


)


From the makers of the renowned LASERDYNE 795 BeamDirector


www.primapower.com See us at #6975 Prima Pwer Laserdyne MFG ENG 1/2 island IMTS ad r2 copy.indd 1


Booth #E-5139 MfgEngMedia.com


6/6/14 2:05 PM


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