SWISS FOCUS | ARTICLE
<< Figure 3: Flexible polymer micro fluidic chip with laser cut
micro channels and drilled holes. >>
<< Figure 4: A hole of 0.3
mm diameter in a ceramic chip. >>
<< Figure 5: A glass-chip (6 mm x 9 mm) with laser
structured gold electrodes and two square openings laser-cut into the glass substrate. >>
<< Figure 6: LEDs with light-guide pyramid. A footprint of 0.6 mm x 0.8 mm, manufactured by cold ablation from a polycarbonate array. >>
Nearly all relevant materials —metals, semiconductors, glass, ceramics, polymers, elastomers, or composites —can be processed using picosecond lasers, thus enabling ablation, cutting, drilling or marking. Combinations of various processes are possible. For example a thin gold layer on a glass wafer can first be laser structured without affecting the glass substrate Subsequently, holes and outer chip contours can be cut by changing the laser parameters. Such processing offers new options in micro manufacturing.
CSEM pushed industrial exploitation of laser micro manufacturing during the last years. Companies who do not intend to invest big sums in laser equipment benefit by outsourcing prototyping or small-series production. But even companies already equipped with such infrastructure can benefit from CSEM’s core competence in this field through feasibility studies and development of new, robust laser structuring processes.
20 | commercial micro manufacturing international Vol 6 No.6
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