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SC13 preview


Chelsio is delivering hardware and soſtware solutions including Unified Wire Ethernet network adapter cards, unified storage soſtware, high performance storage gateways, unified management soſtware, bypass cards, and other solutions. At SC13, Chelsio will


demonstrate, T5 ASIC based Unified Wire Network Adapter T580 and its superior iSCSI SAN performance. In addition, Chelsio will demonstrate its iWARP (RDMA over Ethernet) technology running at 40 Gb. www.chelsio.com


compared to traditional data centres, despite being just as easy to maintain as standard, air-cooled servers. Te bullx DLC B700 range is based on industry-standard components, which are all cooled through direct contact with a cold plate. Te bullx DLC B700 features the latest processor technologies, including also Intel Xeon Phi coprocessors and Nvidia Tesla GPUs. www.bull.com


Caps entreprise (#1127) will present the latest features of its flagship compiler, Caps OpenACC, and will launch a new entity, Caps engineering. Capitalising on 12 years of experience in developing parallel compilers and its expertise in processor architectures, Caps has created Caps engineering to answer its customers’ requests. Tis new entity offers a large range of consulting services to make applications efficiently parallel, such as application diagnosis for the performance, code porting and code optimisation, as well as a set of parallel computing courses to get the relevant expertise in OpenACC, Cuda, OpenCL, OpenMP, and Intel Xeon Phi Programming, among others. www.caps-entreprise.com


Chelsio Communications (#3306) is a leading technology company focused on solving high performance networking and storage challenges for virtualised enterprise data centres, cloud service installations, and cluster computing environments. Now shipping its fourth-generation protocol acceleration technology,


CoCoLink (#4509) has provided supercomputing systems and applications since 2001. Drawing on a rich experience in high- performance computing, the company has developed a supercomputing system with what it says is a unique and innovative architecture. At SC13, CoCoLink will


be showing CliC-80000, a supercomputing system which maximises performance with various computing accelerators such as GPU, MIC and FPGA. CliC-80000 supports 8~16 units of computing accelerators per node with built-in Infiniband FDR, and provides P2P data transmission for equipped accelerators (data transmission from each to each). Tis P2P function ensures that CliC-80000 is an efficient and powerful computing system. In addition, CoCoLink will launch a new system which supports 18 units of accelerators. www.cocolink.co.kr


Coolcentric (#1241) delivers one of the world’s most energy and space efficient heat removal solutions for data centres. Te Coolcentric family of heat exchangers comprise passive, liquid-cooled heat exchangers; standard RDHx; and low Density RDHx-LD to replace standard rear doors on IT rack enclosures. Close- coupled to the IT enclosure, heat exchangers remove heat as close to the heat source as possible, providing the ultimate containment solution. Coolcentric heat exchangers are reliable, scalable, energy efficient and space-saving turn-key cooling solutions that help drive down


26 SCIENTIFIC COMPUTING WORLD


CoolIT Systems (#1916) is featuring a variety of DCLC solutions, including the AHx and CHx systems in 45U, 25U and 12U arrangements, at this year’s supercomputing event. CoolIT’s Direct Contact Liquid Cooling (DCLC) technology delivers what the company says is industry leading data centre solutions for the HPC, cloud and enterprise markets. Te Rack DCLC product line


provides scalability, modularity and flexibility to meet even the most aggressive density, efficiency and performance requirements.


capital and operation costs. Tey can provide sensible cooling for rack loads from 5kW to 40kW. Factory certified technicians are


available to provide installation, commissioning and preventive maintenance throughout the world. www.coolcentric.com


DataDirect Networks (DDN) (#1307), a leader in HPC storage, will preview burst buffer concepts and demonstrate current products spanning block, file and object storage including application-aware hybrid storage, integrated parallel file system appliances, accelerated analytics, and secure private cloud. Register for DDN’s annual user


group at www.ddn.com to see how leading HPC sites around the world are tackling petascale big data problems today and preparing for exascale. Also see Dr James Coomer’s presentation on real- world results of implementing SSDs to benefit parallel file system performance. www.ddn.com


Founded at the University of Edinburgh in 1990, EPCC (#3932) is a leading European centre of expertise in advanced computing research, high-performance computing and technology transfer. Te CRESTA project, which EPCC leads, will share the European Exascale Projects booth (#3741) with the other major European Exascale initiatives. Alongside the exhibits,


With more than 40 issued patents, 12 years of product innovation and more than one million CPU’s being chilled by CoolIT’s DCLC technology, the company offers some of the most advanced direct contact liquid cooling solutions in the world. www.coolitsystems.com


EPCC is involved in a number of the workshop and Birds of a Feather (BoFs) sessions. It is organising the ‘Building on the European Exascale Approach’, ‘HPC Training Perspectives and Collaborations from PRACE (Europe), XSEDE (US) and RIKEN AICS (Japan)’, and ‘G8 Extreme Scale and Big Data Program: Progress on Current Exascale Projects and Future Funding Opportunities’ BoFs. Furthermore, EPCC staff are organising a workshop on ‘Exascale MPI’. www.epcc.ed.ac.uk


European Exascale Projects will be exhibiting on booth #3741 at SC13. Te drive to develop, produce and exploit exascale platforms has led to distinct strategies across continents, differences in expertise and drivers defining the approaches taken. In Europe, significant investment has been made in three complementary research projects: CRESTA, DEEP and Mont-Blanc, with a combined funding of €25 million. As well as developing novel


prototype hardware, these projects are defined by their co-design approach to soſtware and application development, their investment in European leadership tools and scientific applications, and their cross-project collaboration as part of a European exascale community. Tese projects are now well established and the booth will


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