News Industry Spotlight In brief... EU research into microelectronics
The latest uIBX-210 from the BVM Group is a complete PC housed in a very small rugged extruded aluminium enclosure. Ready to run out of the box, the machine can be supplied with WES2009, WES7 or Windows 7 Professional OS pre-installed on the internal HDD or SSD. The PC is based on the Intel 3rd Generation Atom N2600 1.6GHz processor, with an Intel NM10 chipset and supports up to 2GB of DDR3 memory.
www.bvm-store.com
A major research project in Europe exploring highly inte- grated system-in-package solu- tions has reached a pinnacle of discovery. The ESiP (Efficient Silicon Multi-Chip System-in- Package Integration) project part- ners have achieved future system-in-package solutions that it claims are more compact and reliable. They have also devel- oped methods for simplifying analyses and tests.
The project was managed by Infineon Technologies, whilst 40 research partners – microelec- tronics companies and research institutions – from a total of nine European countries collaborated. The project explored the devel- opment of technologies combining
chips in SiP packages along with procedures for measuring relia- bility methods as well as equip- ment for failure analysis and testing. Basic technologies were developed that enable the integration of various types of chips in the smallest volume of an SiP package. “With the ESiP findings we are able to further miniaturise and improve microelectronic systems. We have developed new manu- facturing processes and materials for SiP solutions along with methods for testing them, run- ning a failure analysis and evaluat- ing their reliability, ”said Dr. Klaus Pressel, ESiP project head at Infineon. Infineon Technologies
www.infineon.com
Connectors for Ethernet applications
An industry first, 1W LED manufactured on 200mm silicon wafer is now available from TTI Inc. Made by Toshiba, the new TL1F1 white LED series is offered as a cost-competitive alternative to current LED packages. LED-chips are typically produced on 2- 4-inch wafers with an expensive sapphire substrate. Toshiba and Bridgelux, Inc. have developed a process for manufacturing gallium nitride LEDs on 200mm silicon wafers. The new gallium nitride-on-silicon (GaN-on- Si) technology has enabled the company to replace sapphire substrates and to produce the LED-chips on a much more cost- competitive silicon substrate.
www.ttieurope.com
Sections focusing on RFID on the Harting Technology Group’s website have been updated. The new layout of the site guides users through the pages, covering information about RFID transponders, readers and software. In addition there is now a new section devoted to the company’s Ha-VIS Middle- ware: a system that provides integration of RFID hardware into existing software systems. This website covers all aspects of the technology from RFID basics to new applications such as asset tracking of industrial components.
www.harting-rfid.com
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The Binder range of M8 shielded cable connectors has been extended to accommodate cables up to 6 to 8mm so that they can be used with Ethernet cables. Previously this range of connec- tors only accommodated cables up to 5.5mm diameter but a new, wider cable gland extends the
application area to include indus- trial Ethernet and applications requiring larger diameter cables. These devices are protected to IP67 when mated and are avail- able in a three and four pole male and female format and have a shielded, nickel-plated brass connector body along with gold- plated brass male and bronze female contacts. Termination is via a secure screw clamp and the rated current is 4A. The connectors have a life in excess of 100 mating cycles. Binder UK
www.binder-connector.co.uk
Comment
4A step-down µModule regulator’s
A new 14V, 4A step-down µModule regulator from Linear Technology has been released. The device is a 6.25 by 6.25 by 5.01mm BGA which, including a few passive compo- nents, fits within 1cm
2 2 on a single- sided PCB or 0.5cm double-sided.
The LTM4624 includes a DC/DC controller, power switches, inductor
and compensation in a single pack- age. It delivers a regulated output adjustable between 0.6V to 5.5V and is ideal for applications in telecom, datacom, networking and industrial equipment, medical diagnostic equip- ment, military and aircraft systems. Operation is at a 1MHz typical switching frequency with a low 5mV output ripple at full load during a 12VIN
to 1.5VOUT conver-
sion. The device can operate from an input voltage as low as 2.375V. Overcurrent and overtemperature fault protection are included in the regulator. Linear Technology Corporation
www.linear.com/product/LTM4624
The term IoT is quickly becoming a household phrase and unsurprisingly so as more and more devices join the ‘connected revolution’. One interesting use I recently discovered for your smart phone is an app developed by a Nasa engineer that uses your smart phone to animate your clothing; which can be used as a really cool Halloween outfit. Available @
www.digitaldudz.com - just download the app, fit your phone into a pocket sewn into the back of your t-shirt and hey presto, animated eyes in a cutout in your outfit or something more gruesome… pretty impressive hey? Ok maybe for about ten minutes! But one thing that is set to last is wireless technology and the proliferation of the Internet. Wireless technology is a key feature focus in this issue with an article from LPRS that explores the latest in SoC technology. Along with Commscope exploring 4G network deployment and the major overhaul involved for mobile operators. But to make all these things functional we need smaller components that make smaller devices. The current manufacturing trends of microelectronics are being explored in the latest cutting edge exhibition focusing on MEMS technology taking place at the NEC in September. Check out p6 for more info or visit:
www.connectingindustry/electronics for all of the latest news. Michelle Winny, Editor
Events
Micro|Nano|MEMS 2013
25th & 26th September 2013 at the NEC, Birmingham
Showcasing micro, precision, mems and nano manufacturing technologies
www.micronanomems.com
SEPTEMBER 2013 Electronics
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