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Dow successfully launches FORTEGRA toughening technology at 2013 APEX EXPO
Dow Chemical Company (NYSE: DOW) announced an expansion to its FORTEGRA™ toughening technology designed to help improve the toughness of epoxy systems for electrical laminates, as well as structural adhesives, composites, castings and coatings. FORTEGRA 351 toughening
technology increases the reliability and durability of electrical laminates, helping the laminates to withstand high mechanical stresses during the drilling process, while also helping to maintain the thermo-mechanical and electrical properties of the laminate board. Dow will present the technology in San Diego at the IPC APEX EXPO Conference and Exhibition on Thursday, February 21st at 11:45 a.m. The paper is entitled Effect of Toughening and
E-Glass Sizing on Fracture Toughness and Delamination in High Thermal Stability Electrical Laminates. “FORTEGRA™ toughening
technology from Dow offers three distinct chemistries to address industry needs, helping customers minimize changes to existing equipment or processes,” said Akira Kato, global laminates marketing leader at Dow. “With the addition of the FORTEGRA 351 toughening technology, Dow offers one of the most comprehensive portfolios of toughening technologies in the market.” The expanded FORTEGRA™
product line is based on dispersed pre-formed particulate toughening technology, which complements the existing proprietary Dow block copolymer technology introduced in 2007. The technology is designed to help laminate producers offer a toughened epoxy system with high thermal stability. These properties
are increasingly important due to the introduction of lead-free solder, which requires higher assembly temperatures. FORTEGRA 351 can help to
increase the durability of the laminate board which can be prone to cracking and defects during the drilling process. The cracking of the laminate board during drilling and downstream part fabrication processes can present serious part reliability challenges. Samples of FORTEGRA 351 epoxy
toughening technology are now available for formulator evaluation by contacting a Dow technical representative. Dow is a global supplier of materials and technologies to the electronics industry, including the printed circuit board, semiconductor, interconnect, fi nishing, photovoltaic, display, LED and optics market segments. More information about Dow can be found at
www.dow.com.
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