NEWS // FEATURES // NEW PRODUCTS
Molex capacitive fl uid-level sensors use advanced software for greater accuracy
Molex Incorporated recently introduced customised capacitive fl uid-level sensors, a low-cost measuring solution with disposable sensors and reusable electronic circuitry. Designed for measuring fl uid or granular material in non- metallic containers, the patent pending sensor electrode design and confi gurable software provide higher accuracy with lower hardware cost and easier installation. “Many factors go into customer
selection of fl uid-monitoring equipment for industrial and commercial processes,” states Steve Fulton, engineering manager, Molex. “Capacitive fl uid-level sensors solve the challenge of detecting substances in containers for continuous and threshold measurement without directly contacting the materials.” Custom designed capacitive
fl uid-level sensors are optimised for medical intravenous (IV) drip-feed bags, automotive fuel tanks, agricultural fl uid tanks, hydraulic fl uid and pump controls, beverage dispensing systems and other industry applications. Featuring multiple output interface options, including SB, I2C and discrete signals, the capacitive sensors provide a customised interface for virtually any application requirement. The sensors deliver 95 percent accuracy
in auto mode and are 98 percent accurate when calibrated manually. The embedded software can be confi gured for maintenance-free auto-calibration or manual calibration to maximise sensor accuracy. Equipped with fl exible circuitry,
which conforms to the container shape via pressure-sensitive adhesive, the capacitive sensors are easily mounted to the outside of a container allowing measurement of caustic fl uids, in addition to granular and pulverised materials. The sensors can measure through almost any non- metallic material. Featuring solid-state capacitive technology with no moving parts, capacitive sensors eliminate problems with mechanical wear over time. Providing design fl exibility, sensor circuitry substrate options include PCB, polyester fl exible circuit and polyimide fl exible circuit. A design can use a traditional PCB for a fl at surface container or a thin, fl exible circuit to accommodate curved surfaces or space-constrained applications. The new fl uid-level capacitive
sensors can be mated with virtually any Molex interconnect or cable assembly. They are fully compatible with integrated designs using Molex customised user interfaces, including membrane switches and capacitive touch technology. For additional information visit:
www.molex.com/ link/fl
uidsensor.html or
http://www.molex.com.
Compact version of Han-Yellock connector
The Han-Yellock® is a new, compact addition to HARTING’s established Han-Yellock(R) family of modular industrial connectors. The availability of 25 different
contact inserts means that the Han-Yellock(R) 10 can be adapted to a wide range of applications from energy supply to data transmission. The universal modular design of the connector means that a single unit can reliably transmit power of up to 40 A at 690 V alongside sensitive data signals, as in Ethernet applications. This universality is extended by the availability of multipole varieties incorporating up to 21 contacts, including inserts for optical data transmission. The key features of the Han-
Yellock(R) family – notably its ease of handling and operation – are embodied in the Han-Yellock(R) 10. The locking mechanism integrated in the housing locks both housing halves reliably during the connection process. The new connector also helps to
ensure reliable data transmission by offering a high degree of protection against electromagnetic interference. This is provided in the Han-Yellock(R) family by the nesting of both housing halves and the direct electrical connection between the housing and the adjacent surface. Large-diameter sheathed cabling is also enabled via an M25 cable input. For further information visit
www.HARTING.com 22 EIU
www.electronicscomponentsworld.com /
www.electronicsproductionworld.com February 28th 2013
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