NEWS // FEATURES // NEW PRODUCTS
A new technology for void-free refl ow soldering is now available
SEHO Systems GmbH, a worldwide leading manufacturer of automated soldering systems and customer- specifi c solutions, now offers a new technology for virtually void-free soldering results with the MaxiRefl ow HP. Whether for power electronics,
electronic aviation systems, medical equipment or electronic systems for the automotive industry, voids in solder joints represent one of the main problems. Enclosed voids can cause a displacement of electrical and thermal paths as well as a local concentration of power and heat. Additionally, gas voids are quick to form spheres in the solder gap, which could cause the tilting of chip components and a wedge-shaped solder gap. The amount of voids can be
infl uenced by different measures such as a good wettability of metallization, solder pastes with special adopted solvents and an adequate preheating profi le. However, to achieve virtually void-free solder joints, a special vacuum process step during soldering was demanded. This vacuum process is associated with some essential disadvantages. Apart from the technical expenses for vacuum pumps and additional locks, the vacuum process excludes the use of gas convection for heating, resulting in an uneven heat distribution on the assemblies. SEHO’s MaxiRefl ow HP offers
innovative technology that ideally combines convection heat and a special hyper-pneumatic module, thus ensuring virtually void-free solder connections. Instead of using a complicated vacuum process, MaxiRefl ow HP is equipped with an effective excess pressure chamber, allowing shorter cycle times and enabling gas convection to be used for heating assemblies.
26 EIU
Each heating zone of the
MaxiRefl ow HP – as well as the zones integrated in the hyper-pneumatic chamber – has a tangential fan that ensures an absolutely homogeneous heat distribution with the large volume of ventilated process gas. This enables the most effective and component-sensitive heating of the products with set temperatures on a low level. When processing
uncritical assemblies, the MaxiRefl ow HP, of course, also can be operated without activating the hyper- pneumatic chamber. In this case, the printed circuit boards go through a conventional refl ow soldering process. For more information about the
SEHO MaxiRefl ow HP, visit
www.seho. de..
Seika Machinery picks up processing speeds with the Sayaka SAM-CT23W
Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, introduces the Sayaka SAM-CT23W Twin-Table PCB Router. The two-way fl exible setting twin-table design provides faster, high-precision
processing and accommodates two boards up to 9.8x13” (250x330 mm). The fl exible twin fi xture tables can be converted into one large size fi xture table that accommodates one PCB up to 13x20” (330x500 mm). The automatic bit depth control
feature extends bit life and reduces bit usage. Additional features include large component height clearance (top- and bottom-sides) as well as an easy-to-use, CAD-based, off-line software program. For more information about Seika
Machinery, Inc.’s new Sayaka SAM- CT23W, visit
www.seikausa.com.
www.electronicscomponentsworld.com /
www.electronicsproductionworld.com February 28th 2013
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