Automotive Electronics
CiE: What trends are you seeing in terms of the adoption of magnetic position sensing applications?
Gessner: We see a strong trend in the safety area. Magnetic position sensing applications can often be used as a replacement for unreliable and dust/dirt sensitive potentiometer technology. It is the ideal solution for meeting the demands for increased precision, improved safety (e.g. ISO 26262, self- diagnostics) and resolution requirements. We’ve also noticed an increased use of BLDC motors. We reacted on this trend and have ICs available which specifically fit this application. Our patented hall-based position sensing technology has been designed to guarantee immunity to stray magnetic fields, resulting in both robustness and lower system costs. Our portfolio includes rotary position sensors, which detect the absolute angular orientation of an on-axis 2-pole magnet, rotating over the centre of the IC. We also produce 3D absolute position sensors that are capable of detecting the absolute linear position of a 2-pole magnet, as well as absolute angular orientation in on- and off-axis systems.
Magnetic position sensing solutions will definitely find new uses in applications with 3D hall sensors, such as transmission, steering or gear sticks. The issue of reliability in transmission applications is a further trend, with the advantages of hall based sensors
becoming very clear- hall based sensors are non-contact, and are therefore immune from wear.
CiE: What impact is the importance attached to battery management having on application development and how is ams responding?
Gessner: Our strategy is to offer highly accurate and flexible solutions. Strategically, we offer a full range of battery management solutions for the 12V, 48V, high voltage Li-Ion applications as a platform solution, as well as offering special features to support safety critical applications (ISO26262 standard). Because the complete solution (and not the single IC) is the most important factor to our customers, we provide reference designs, which give a very good idea of the complete system and possible form factor. The high -side reference design presents practically relevant implementation of an automotive 12V Battery Sensing System, using the AS8510 Sensor Front End IC, in combination with the AS8525 System Base Chip and a 16FX-Series Microcontroller from Fujitsu. Additionally, we have a low- side reference design available, as well as pure demo kit. It’s of huge importance to understand the complete application, share possible application diagrams and be in on-going discussion with our partners/customers. The key is excellent battery
management application support on one hand, and the development of reference systems on the other hand.
CiE: Looking into the future how is the automotive sector likely to develop over the coming 5 years?
Gessner: We think that there will be a battle of powertrain technologies until 2020. We also believe that up to then, fewer than 10% of all vehicles will be EVs and HEVs. The main challenge for E- Mobility is still the battery, in particular the low range, safety and size. Pure battery EVs will be limited to city driving. Extended range electric vehicles allow very flexible usage, and can be the first vehicle in a family. Another huge trend to come is the idea of developing a “connected car”. Car-to-car and car-to-internet communication should create an innovative information system that assists the driver. For example, mobile phone and car can connect, and customers can either wake up single segments of the car, or even park using their smart phone. As the progressing electrification of the powertrain increases the need for reliable and safe electronic parts, there will be a close cooperation between OEMs and semiconductor manufacturers. As a result of this, safety standards as ISO26262 are gaining even more importance to our customers and OEMs.
Integrated smart electronics will play
a key role in developing and improving safety and comfort gadgets. One of the main ideas is the fusion of multiple data, such as ultrasound, sensors and cameras. The visions for 2020 include
vehicles driving autonomously, or emergency breaking with 6D vision. Most of the trends lead to an increase
of electronics in cars, therefore the automotive semiconductor market is said to increase from 18 billion to 34 billion in 2018.
For the next five years we expect an
increasing number of design-ins in the following application areas: • Conventional car electrification and
reinforcement of 12V board net • Introduction of 12V Li-Ion • EDLC energy buffer • 48V board net • HV battery management for plug in hybrid vehicles and range extender vehicles, e-bikes and e-scooters, • Non-automotive areas: solar street lighting, non-interruptible power supplies, PV energy buffer Within a period of more than five years
we are planning design-ins for e.g. FEV HV battery management or Li-Ion energy buffer in pulsed thermodynamic systems.
CiE: How will ams adapt and change in the light of the changes identified above?
Gessner: ams is continuously developing innovative standard products, which can also be used as an IP development platform for new ASICs. We are concentrating on our strong position in terms of new safety requirements (ISO26262) in all product areas. ■
ams |
www.ams.com
www.cieonline.co.uk
Components in Electronics
October 2012 13
Page 1 |
Page 2 |
Page 3 |
Page 4 |
Page 5 |
Page 6 |
Page 7 |
Page 8 |
Page 9 |
Page 10 |
Page 11 |
Page 12 |
Page 13 |
Page 14 |
Page 15 |
Page 16 |
Page 17 |
Page 18 |
Page 19 |
Page 20 |
Page 21 |
Page 22 |
Page 23 |
Page 24 |
Page 25 |
Page 26 |
Page 27 |
Page 28 |
Page 29 |
Page 30 |
Page 31 |
Page 32 |
Page 33 |
Page 34 |
Page 35 |
Page 36 |
Page 37 |
Page 38 |
Page 39 |
Page 40 |
Page 41 |
Page 42 |
Page 43 |
Page 44 |
Page 45 |
Page 46 |
Page 47 |
Page 48 |
Page 49 |
Page 50 |
Page 51 |
Page 52 |
Page 53 |
Page 54 |
Page 55 |
Page 56 |
Page 57 |
Page 58 |
Page 59 |
Page 60 |
Page 61 |
Page 62 |
Page 63 |
Page 64 |
Page 65 |
Page 66 |
Page 67 |
Page 68