11-11/12 :: November/December 2011

nanotimes

Companies Facts

to introduce the world’s first three dimensional touch panel product. Unidym will supply carbon nanotube-based products to Nissha for Nissha’s three dimensional touch panels.

http://www.unidym.com http://www.winbond.com W

inbond Electronics Corp., a leading global supplier of specialty memory solutions for

computer, consumer and communication applica- tions, announced a family of new SpiFlash®

Serial

Flash memories with the industry’s smallest pa- ckages per density. The small form factors make them ideal for space-critical designs, such as smart phones, Bluetooth headsets, cameras, digital video, gaming, GPS, wireless modules and other mobile/ handheld products. With minimal package dimensi- ons as small as 3.4mm2

Z , these new devices meet the

space-saving needs of the rapidly growing mobile- computing market with a range of densities from 512K-bit to 16M-bit. Available in eight-pin ultra-thin small-outline no-lead (USON) and wafer-level-ball- grid-array (WLBGA) forms, the new SpiFlash me- mories occupy less than 20% of the space used by ordinary 30mm2

WSON and SOIC packages. The new USON 6mm2 (2 x 3 x 0.55mm) SpiFlash

memories come in densities of 512Kb, 1Mb, 2Mb, 4Mb and 8Mb in 2.5V or 3V versions; power-saving 1.8V versions are also available for 2Mb and 4Mb densities. The 8Mb USON is the industry’s highest density available in such a package. The WLBGA de- vices, which use a Wafer-Level-Chip-Scale-Packages (WLCSP) assembly process, are available in 8Mb (3.4mm2

) and 16Mb (4.8mm2 ) densities that operate at 1.8V. The WLBGAs are 0.47mm in height and use

EN software was launched by Carl Zeiss for confocal laser scanning microscopes in 2007.

The extremely logical structure of the ZEN user interface has received much praise and recognition from customers all over the world. Highly complex experiments can be designed and executed by users with minimal training and support. Moreover, with the Axio Vert.A1, Carl Zeiss is now introducing a compact, inverted light microscope that can be used for different, large test pieces and components. The microscope can be used in metallography and mate- rials testing.

http://www.zeiss.de/press/pr0035b7cb Z

yvex Technologies, and NanoFusing LLC; a subsidiary of APV Engineered Coatings (U.S.)

have announced a partnership to provide nano- enhanced concentrates and products to the infra- structure markets and OEM industries. The first application for this partnership is expected to be with a large automotive supplier.

http://www.zyvextech.com http://www.apvcoatings.com http://www.nanofusing.com

11% and 16% the space, respectively, of a WSON or SOIC package, making them the smallest and thinnest packages on the market today. The WLBGA packages also provide design security by preventing access to the chips’ signals once mounted to PCBs.

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