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By comparison, current state-of-the-art devices deli- ver 12.8 GB/s. HMC also requires 70% less energy to transfer data while offering a small form factor – just 10% of the footprint of conventional memory.
http://www.micron.com http://www.ibm.com/chips
anti-reflective coating, lithography based patterning and Aluminum metallization. The realized IBC cells achieve a designated area conversion efficiency of 23.3% (Jsc = 41.6 mA, Voc=696 mV, FF=80.4%), certified by ISE-Callabs.
http://www.imec.be http://www.kaneka.co.jp/kaneka-e/
I
mec together with its silicon photovoltaic industrial affiliation program partners Schott Solar, Total,
Photovoltech, GDF-SUEZ, Solland Solar, Kaneka and Dow Corning, have demonstrated an excellent conversion efficiency of 23.3% on interdigitated back-contact (IBC) silicon solar cells.
I
MS Nanofabrication AG, Austria, has signed an equity funding round with participation from
Intel Capital, Photronics Inc. and private investor groups. Based on its extensive know-how in charged particle systems, IMS offers solutions to directly trans- fer custom designed patterns to resist or to generate resist-less two and three dimensional surface modifi- cations with features below 20nm.
Key aspects of the newly developed small-area (2x2 cm2
(FZ) silicon substrates, a random pyramid texture, a boron diffused emitter, phosphorous diffused front- and back surface fields, a thermally grown silicon dioxide for surface passivation, a SiN single layer
) IBC Si solar cells are the n-type base float-zone
nfineon Technologies AG (OTCQX: IFNNY) introduced automotive qualified 100% lead-free
power MOSFETs for TO package types. Based on the combination of innovative packaging technology and Infineon’s thin wafer process technology, the new 40V OptiMOS™ T2 power MOSFETs offer best-in- class specifications. Infineon uses a diffusion solde- ring die attach approach to produce the lead-free packages that include TO-220, TO-262 and TO-263. Because of specific requirements in terms of package geometry, die pad thickness and chip size the dif- fusion soldering die attach approach is today only suitable for these three package types, and Infineon is able to supply them: OptiMOS T2 products in
11-11/12 :: November/December 2011