Materials Case Study
21
cooperative model with all three parties participating, led by fab operators and organized to meet their goals. The proposed model offers a path for improving yields and process ROI as an alternative to a system driven primarily by demands for reduced material and tool costs, by focusing on the total cost (time and money) of inefficient processes. Genuine savings and verifiable
improvements in total cost of ownership can be achieved by establishing early collaboration interactions before final technology integration is locked down – before final chemistry formulations are established, before final tool characteristics are established and before key process step decisions are made.
Better Integration Will Drive Innovation
The implementation of sub-22 nm nodes creates increasing pressure on both tool builders and wet chemistry suppliers to create more innovative solutions to key process steps, such as wet etch, photoresist strip and post-etch residue removal. Ever-more complex geometries and a wider range of substrate materials represent two examples of the types of challenges both face.
Equally challenging is the fact that, too often, as new nodes and new process steps are developed by fab operators, chemistry suppliers and tool builders work separately from each other, developing solutions at the direction of
www.euroasiasemiconductor.com Issue III 2011
Page 1 |
Page 2 |
Page 3 |
Page 4 |
Page 5 |
Page 6 |
Page 7 |
Page 8 |
Page 9 |
Page 10 |
Page 11 |
Page 12 |
Page 13 |
Page 14 |
Page 15 |
Page 16 |
Page 17 |
Page 18 |
Page 19 |
Page 20 |
Page 21 |
Page 22 |
Page 23 |
Page 24 |
Page 25 |
Page 26 |
Page 27 |
Page 28 |
Page 29 |
Page 30 |
Page 31 |
Page 32