Materials Case Study


20


Cooperative improvement Advances in semiconductor manufacturing


require cost benefits as much as technology innovation. Surface preparation processes are an area were both issues need addressing and there are calls for cooperation along the value chain. John Bubel, Director of Marketing, Electronic Materials at Avantor Performance Materials discusses strategies for reducing costs and provides a case study with SSMC to show how cooperation leads to better materials, tools and processes


n past nodes, when traditional wet chemistries were initially tried in new equipment or with new substrate materials and integration schemes, costs could increase and added time was required to rework processes in order to reach optimum process stability and yield. Problems significantly impacting yield and


I


ROI often arose, due to incompatibility between chemistry, tool functionality and device compatibility. As a result, both captive and foundry fab operators, as well as others in the supply chain, have been seeking novel interaction models to speed new node ramp through faster development of wafer surface preparation solutions. There are fundamental advantages associated with pursuing a new


www.euroasiasemiconductor.com  Issue III 2011


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