2011 IEEE Compound Semiconductor IC Symposium
INTEGRATED CIRCUITS IN GaAs, InP, SiGe, GaN and OTHER COMPOUND SEMICONDUCTORS October 16–19, 2011
Hilton Waikoloa Village on Hawaii’s Big Island, HI, USA Sponsored by the IEEE Electron Devices Society
Technically co-sponsored by the Solid State Circuits Society and the Microwave Theory & Techniques Society
2011 CSIC Symposium From its beginning in 1978 as the GaAs IC symposium, CSICS has evolved to become the preeminent international forum for developments in compound semiconductor integrated circuits, embracing GaAs, InP, GaN, SiGe, and more recently, CMOS technology. Coverage includes all aspects of the technology, from materials issues and device fabrication, through IC design and testing, high volume manufacturing, and system applications. The IEEE Compound Semiconductor IC Symposium (CSICS) provides the ideal forum to present your latest results in high-speed digital, analog, microwave/millimeter wave, mixed mode, and optoelectronic integrated circuits. First-time papers concerned with the utilization and application of InP, GaAs, SiGe, GaN and other compound semiconductors in military and commercial products are invited.
Symposium Highlights High quality technical papers will be selected from worldwide submissions for oral presentation and publication in the Symposium Digest. Invited papers and panel sessions on topics of current importance to the Compound Semiconductor IC community will complete the program. Extended versions of selected papers from the Symposium will be published in a special issue of the IEEE Journal of Solid State Circuits.
Compound Semiconductor Primer Course& Short Course The Symposium will again offer the popular primer course, “Basics of Compound Semiconductor ICs,” which is an introductory-level class intended for those wishing to obtain a broad overview of RFIC and High-Speed Analog-Mixed Signal technology. The Sunday evening course will cover Si/SiGe, GaAs, InP and GaN materials and processes, BJT/HBT, HEMT & FET device operation, and both analog/microwave and digital ICs. The Course will be tailored to provide the specific background needed for participants to understand and appreciate the papers presented in the Symposium Technical Program.
2011 Compound Semiconductor IC Symposium Exhibition As in past years, the Symposium will sponsor an exhibition of products from various vendors of materials, IC products, processing equipment, test equipment, CAD tools, and foundry services specifically addressing the Compound Semiconductor industry. Numerous vendors will be on-hand to discuss their products and to answer questions. Inquiries concerning the exhibits should be addressed to: Jim Carroll, AWR Corporation, Tel: +1 469-248-5462, Email:
jim.carroll@
awrcorp.com
Conference Venue Join CSICS attendees as we “Explore the Spirit of Aloha” at Hilton Waikoloa Village. Located on the Kohala Coast of the Big Island of Hawaii in the midst of Waikoloa Beach Resort, the extraordinary property offers an unforgettable experience shrouded in breathtaking gardens, rich wildlife, and tranquil waterways. Plan to come early or stay after the conference to immerse yourself in island culture and tradition at Hilton Waikoloa Village - a truly inspired destination, offering an authentic Hawaiian experience in an unforgettable oceanfront setting.
Symposium Chair: Dan Scherrer, Northrop Grumman, Ph: +1-310-812-5892, Email:
Dan.Scherrer@
ngc.com For more information please visit the website at
www.csics.org
Page 1 |
Page 2 |
Page 3 |
Page 4 |
Page 5 |
Page 6 |
Page 7 |
Page 8 |
Page 9 |
Page 10 |
Page 11 |
Page 12 |
Page 13 |
Page 14 |
Page 15 |
Page 16 |
Page 17 |
Page 18 |
Page 19 |
Page 20 |
Page 21 |
Page 22 |
Page 23 |
Page 24 |
Page 25 |
Page 26 |
Page 27 |
Page 28 |
Page 29 |
Page 30 |
Page 31 |
Page 32 |
Page 33 |
Page 34 |
Page 35 |
Page 36 |
Page 37 |
Page 38 |
Page 39 |
Page 40 |
Page 41 |
Page 42 |
Page 43 |
Page 44 |
Page 45 |
Page 46 |
Page 47 |
Page 48 |
Page 49 |
Page 50 |
Page 51 |
Page 52 |
Page 53 |
Page 54 |
Page 55 |
Page 56 |
Page 57 |
Page 58 |
Page 59 |
Page 60 |
Page 61 |
Page 62 |
Page 63 |
Page 64 |
Page 65 |
Page 66 |
Page 67 |
Page 68 |
Page 69 |
Page 70 |
Page 71 |
Page 72 |
Page 73 |
Page 74 |
Page 75 |
Page 76 |
Page 77 |
Page 78 |
Page 79 |
Page 80 |
Page 81 |
Page 82 |
Page 83 |
Page 84 |
Page 85 |
Page 86 |
Page 87 |
Page 88 |
Page 89 |
Page 90 |
Page 91 |
Page 92 |
Page 93 |
Page 94 |
Page 95 |
Page 96 |
Page 97 |
Page 98 |
Page 99 |
Page 100 |
Page 101 |
Page 102 |
Page 103 |
Page 104 |
Page 105 |
Page 106 |
Page 107 |
Page 108 |
Page 109 |
Page 110 |
Page 111 |
Page 112 |
Page 113 |
Page 114 |
Page 115 |
Page 116 |
Page 117 |
Page 118 |
Page 119 |
Page 120 |
Page 121 |
Page 122 |
Page 123 |
Page 124 |
Page 125 |
Page 126 |
Page 127 |
Page 128 |
Page 129 |
Page 130 |
Page 131 |
Page 132 |
Page 133 |
Page 134 |
Page 135 |
Page 136 |
Page 137 |
Page 138 |
Page 139 |
Page 140 |
Page 141 |
Page 142 |
Page 143 |
Page 144 |
Page 145 |
Page 146 |
Page 147 |
Page 148 |
Page 149 |
Page 150 |
Page 151 |
Page 152 |
Page 153 |
Page 154 |
Page 155 |
Page 156 |
Page 157 |
Page 158 |
Page 159 |
Page 160 |
Page 161 |
Page 162 |
Page 163 |
Page 164 |
Page 165 |
Page 166 |
Page 167 |
Page 168 |
Page 169 |
Page 170 |
Page 171 |
Page 172 |
Page 173 |
Page 174 |
Page 175 |
Page 176 |
Page 177 |
Page 178 |
Page 179 |
Page 180 |
Page 181 |
Page 182 |
Page 183 |
Page 184 |
Page 185 |
Page 186 |
Page 187 |
Page 188 |
Page 189 |
Page 190 |
Page 191 |
Page 192 |
Page 193 |
Page 194 |
Page 195 |
Page 196 |
Page 197 |
Page 198 |
Page 199 |
Page 200 |
Page 201 |
Page 202 |
Page 203 |
Page 204 |
Page 205 |
Page 206 |
Page 207