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RF Electronics ♦ news digest


(MCMs) supporting 3G base station transceiver (BST) applications for the wireless infrastructure end market.


Bob Van Buskirk, president of RFMD’s Multi-Market Products Group (MPG), said, “The shipment of over two million MCMs in such a short period of time highlights RFMD’s sharp focus on product and technology leadership and the continued expansion of our product portfolio supporting the wireless infrastructure end market.”


MCMs are highly integrated packages in which multiple ICs and discrete components are assembled onto one unifying substrate to form a single placement RF component. RFMD has been developing and shipping MCMs for the infrastructure industry since 2009. The Company offers a complete portfolio of MCMs to address common frequency bands, 2G/3G standards and all RF functions in the base station transceiver, including transceiver systems for new 4G LTE networks.


RFMD’s MCM products reduce overall current consumption by using power down and other DC power control functions. The associated reduction in component operating temperatures improves component reliability, which is of critical importance in small remote radio heads located in difficult to access locations. The reduced current consumption also benefits manufacturers of multi-standard remote radio head platforms, allowing customers to meet new “green” wireless infrastructure network standards.


John Pelose, general manager of RFMD’s Wireless Products business unit, added, “RFMD is leveraging our extensive library of single function components and industry-leading scale to deliver our customers MCM solutions promptly and efficiently. Our rapid prototyping capabilities enable our customers to improve their product cycle time and reduce time to market. Additionally, our high-volume MCM assembly and test facilities help enable advances in performance at efficient economies of scale.”


Anadigics shipping volumes of multi-band PAs to Qualcomm


The new PA supports five frequency bands, enabling the multi-band Qualcomm Gobi 3000 module.


With the continued development of multi-band and multi-mode mobile devices, manufacturers are seeking new ways to help reduce board space. Anadigics says its new 5 mm x 7 mm x 1mm power amplifier (PA) offers a significant board space reduction when compared with multiple single-band 3 mm x 3 mm solutions.


Anadigics is shipping production volumes of its AWT6521 multi-mode PA for the Qualcomm Gobi 3000 module. The highly integrated AWT6521 PA supports WCDMA/ HSPA+ and CDMA/EVDO in frequency bands used by operators worldwide, providing users with more choice in carrier networks and the freedom to go without fear of losing connectivity. It also features an RF coupler and DC blocks on RF ports. With 2 shared RF inputs, 5 separate 50 Wmatched outputs, the AWT6521 also features internal voltage regulation,


The Gobi 3000 reference design is based on Qualcomm’s MDM6200 and MDM6600 chipsets, both of which can provide support for HSPA+ data rates of up to 14.4 Mbps.


“The Gobi 3000 multi-mode platform provides high data rate wireless functionality to a broad spectrum of mobile devices,” said Jerry Miller, vice president of business development at Anadigics. “Qualcomm’s selection of our new multi-band power amplifier for the Gobi 3000 platform exemplifies the strength of our successful relationship and the performance advantages of this product. We look forward to working closely with Qualcomm to


June 2011 www.compoundsemiconductor.net 125


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