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Furthermore, The Carl Zeiss registration and overlay metrology system for photomasks PROVE™ success- fully passed the Final Acceptance of NuFlare Tech- nology, the world leading supplier of e-beam based mask writers for cutting edge lithography masks. PROVE™ is designed to measure image placement and critical dimension on photomasks with sub- nanometer repeatability and accuracy. Through its superior 193nm optics the system offers higher reso- lution that will enable the EUV mask roadmap. It was collaboratively developed within three years by the Semiconductor Metrology Systems Division in Jena/ Germany, and the Lithography Optics Division in Oberkochen/Germany, it gets manufactured in Jena. http://www.zeiss.de

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EA-Leti announced a multi-partner project to demonstrate high-alignment-accuracy (<1µm)

chip-to-wafer structures made by direct metallic bonding. Such structures are required for high-per- formance 3D integrated circuits and could enable a wide range of applications in microelectronics as well as in optoelectronics or MEMS.

Leti has acquired a customized 300mm FC300 pick- and-place tool from SET, Smart Equipment Technolo- gy, to demonstrate the technology. The customized system will be used by the Minalogic PROCEED project. Minalogic is the global competi- tive cluster specialized in micro- and nanotechnolo- gies and embedded intelligence. In addition to Leti and SET, partners are STMicroelectronics, ALES and the CNRS-CEMES. The PROCEED Minalogic project is a 4.2 million-euro, 24-month project that began in December 2009 and is supported by French FIU (Fond Interministeriel Unique).

The chip-to-wafer direct-metallic-bonding techno- logy was developed at Leti to break through certain 3D-integration limitations. For example, the tech- nology allows chips to be attached to a substrate at low temperature and with low bonding pressure. This technology also allows interconnecting the chip and the substrate electrically through local metallic bonding.

“This collaboration puts Leti in a very good worldwi- de position for 3D-technologies development,” said Leti CEO Laurent Malier. “We will identify the key challenges of 3D product engineering, and chip-to- wafer strategy with direct-metallic bonding is a very promising option for overcoming those challenges.”

CEA-Leti researchers and their partners reported on projects that address fundamental challenges facing next-generation computing, medical diagnosis, com- munications, and portable electronics at ISSCC 2011 in San Francisco, USA. One paper featuring CEA-Leti authors includes work on RF (60GHz) communica- tion chips performed in connection with chipmaker STMicroelectronics to target 60GHz Wireless HD Applications. CEA-Leti demonstrates that it is possi- ble to integrate in standard low-cost CMOS 65nm technology a low-power system-on-chip working in the 60GHz frequency band with a data rate up to 3.8Gbps. The data rate is 70 times higher than tra- ditional 54Mbps WiFi technology. http://www.aselta.com http://www.set-sas.fr http://www.leti.fr/

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hevron Phillips Chemical Company LP (Chevron Phillips Chemical) will begin producing 40 cSt and 100 cSt high viscosity polyalphaolefins this

11-02/03 :: February / March 2011