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nanotimes

Companies Facts

D

ow Electronic Materials (NYSE:DOW) introduced its latest VISIONPAD™ polishing

pads VISIONPAD™ 6000 and VISIONPAD™ 5200. VISIONPAD™ 5200 polishing pads offer next-gene- ration technology that achieves a high removal rate for Tungsten (W), ILD and Cu bulk processes. The new VISIONPAD™ 5200 polishing pads implement unique polymer chemistry and higher pad porosity that achieve a 10 to 30 percent increase in removal rate for W, ILD and Cu Bulk applications.

This increased removal rate allows the customer to reduce polishing times and slurry consumption to significantly lower CMP cost of consumables. VI- SIONPAD™ 5200 polishing pads also offer a 10 to 20 percent reduction in defectivity in W and Cu applications, and improved dishing and erosion in W applications over Dow’s standard IC1000™ polishing pads.

“Dow’s VISIONPAD™ polishing pad series offers the industry an unparalleled CMP platform specifically designed for current and next-generation manufactu- ring,” said Austin Chen, South Asia Regional General Manager for Dow Electronic Materials. “Our inno- vative R&D drove the development of the VISION- PAD™ platform, which gives us the ability to offer the right pad for specific CMP applications. These VISIONPAD™ polishing pads are higher-performing and allow for reduced consumable costs.”

Furthermore, Dow Electronic Materials announced the availability of the KLEBOSOL®

II 1630 Slurry, an

advanced, dilutable slurry that combines the best at- tributes of colloidal and fumed silica slurries. Develo- ped for leading-edge semiconductor manufacturing, the KLEBOSOL®

slurry offers a high-performance,

low cost of consumables alternative for CMP. The KLEBOSOL® II 1630 slurry is formulated with elongated fractal colloidal silica particles. It combines the high stabi- lity and ease- of-handling properties of colloidal sili- ca with a new morphology that provides fumed- like particle planarization and allows for dilution. This makes KLEBOSOL®

10-09 :: September 2010

II

1630 highly cost competitive while maintaining the performance characteristics of colloidal silica slurries, including excellent removal rate stability, low defecti- vity, high planarization and tight process control.

“KLEBOSOL® colloidal silica slurries provide excel-

lent process stability with low defect levels,” said Asa Yamada, global slurry marketing director for Dow Electronic Materials. “We are now driving to lower point-of-use (POU) solids levels to improve end user cost of consumables. This new generation of KLEBO- SOL®

slurries now offers the performance benefits

of colloidal silica with the planarization and dilution capabilities typically associated with fumed silicas. We’ve seen strong interest in this new slurry, with