SHOW PREVIEW: VISION
based on a CHR70M sensor and is suitable for applications including LCD and PCB inspection, aerial imaging, and scientific imaging. Te camera is supplied with a Pleora soſtware
development kit and is USB 3.0 compatible. Te 1.5 version of the camera includes an external trigger for enhanced capture options in automated environments, bootloader capability for FPGA firmware updates, and an automated calibration processor for optimal image results, which can vary from sensor to sensor. Also on show will be a Machcam 120MP
prototype, which uses Canon’s 120-megapixel image sensor.
www.thecrowleycompany.com
Euresys (1H46) will demonstrate its latest CoaXPress frame grabbers, including the Coaxlink Quad CXP-12, a 12.5Gb/s, four- connection CoaXPress 2.0 frame grabber. Also on show will be the Coaxlink Octo, an eight-connection CXP-6 frame grabber. Both support CustomLogic, custom on-board FPGA processing for Coaxlink. Te latest Open eVision libraries will be
shown, including Easy3D, a set of soſtware tools to build 3D inspection applications. Also on display will be the new Camport video converters and the
Picolo.net HD1 H.265 video server, which streams video from one Full HD source over an IP network.
www.euresys.com
EVT (1A63) will present the latest features of its EyeVision 3D soſtware. Te package contains commands for inspecting glue, adhesive beads, and weld seams, as well as for bin-picking. Te core competence of EyeVision 3D is 3D pin
Products designed for embedded vision, as well as Intel’s RealSense 3D vision product suite, will be shown by Framos (1C42). Te company will display various technology and sensor modules, including Framos’ SLVS- EC IP core for Xilinx FPGAs. Te booth will also include the latest Sony and On Semiconductor sensor solutions, showcasing the new Sony IMX250 polarised sensor to support precise spectral measurements, and On Semiconductor’s latest XGS series. On 6 November at 10.30am, Intel’s Miro
Mjelnek will present on the technical innovations in 3D imaging, followed at 11.30am by Xilinx’s Dave Hitt and Framos’ André Brela, who will speak on: ‘How
can future vision systems get increased resolutions, speeds and embedding requirements under control?’
www.framos.com
extract surface detail that cannot be seen using conventional imaging methods. Tree controllers will be in action to
inspection for recognising flaws, such as those in the pin height or true point. EVT will also show the Saturn laser
triangulation sensor with 1kHz resolution. Te sensor is available with red and blue laser versions, and is also GenICam compatible.
www.evt-web.com
Gardasoft Vision’s (1E53) RTCC series of lighting controllers will be used in a demo to drive a segmented dome light so that a smart camera can acquire a rapid sequence of images under different illumination angles. Te camera will use computational imaging soſtware to
FIRST OPC UA VISION PRODUCTS FOR INDUSTRY 4.0 ON DISPLAY
The first products that comply with the new Open Platform Communication Unified Architecture Companion Specification (OPC UA Vision) will be on display at Vision 2018.
OPC UA Vision is an open,
Ethernet-based standard for communication and data exchange in networked systems. The standard is supported by nearly every relevant automation manufacturer and allows machines in smart factories to speak to each other. The first part of the machine vision
companion specification – a generic model for machine vision equipment – was published at the Automatica trade fair in June.
Stemmer Imaging has implemented an OPC UA tool within its Common Vision Blox software; Isra Vision’s embedded systems support OPC UA; and Automation Technology’s software also supports the standard. Dr Christian Mosch from the VDMA Industry 4.0 forum commented: ‘Publication of the OPC UA companion specification for machine
20 Imaging and Machine Vision Europe • October/November 2018
vision is an important step towards cross-manufacturer interoperability in mechanical engineering. Industry 4.0 communication in the future will be based on this development and will be enhanced still further.’ Dr Horst Heinol-Heikkinen,
chairman of the OPC UA Vision initiative of the German Engineering Federation (VDMA) and managing director of Asentics, added: ‘Interoperability is the key to differentiation of our products in a networked Industry 4.0 world.’
demonstrate high-speed focussing on objects of different heights using a liquid lens from Optotune. A CC320 timing controller, positional encoder from a moving platform, camera and RC120 lighting controller will be linked together to give the required camera exposure and illumination needed for imaging. A TR-CL-180 liquid lens controller will be used for high-speed adjustment of the lens for focussing.
www.gardasoft.com
IDS Imaging Development Systems (1F72) will display new models of its vision app-based platform IDS NXT, which allows recurring vision tasks to be set up and changed easily. Te new Ensenso XR series with on- board data processing, will be shown for the first time. Te camera will also be able to transfer 3D data to a control unit via GenICam in the future.
Ensenso XR enables new scopes for application design, accurate acquisition of details, and acceleration of data processing. IDS will also display USB 3.1 Gen 1 board-
level industrial cameras with liquid lens control. Tese cameras facilitate image acquisition at variable object distances as their focus can be readjusted quickly and comfortably via user interface or API. Te cameras are available with a 6.4-megapixel rolling shutter sensor from Sony or the highly photosensitive 18.1-megapixel
@imveurope
www.imveurope.com
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