SWAK-HC wafer line High-capacity wafer production


The  indu thro


ustriial wafe in an oughput s


wafer qual tya ity. At


At the ea 


 Se


ng plat pair and supports  


uppo


e ables gent and he


8 waf


- Con is - -


 e heart of t


    a waferafermanufac ure h ut, stable


c ss   


S lf-supp rting ba n un


helpsm ntai


C nsistent G t e ac Designed


pr duc manage


 rodu tm


-     - 80


esigned for a e pairs rea he 80


nufa tur rs req r ng e processes, an


a d co


the lil ne is the    . Th


  T e ve


pports a totatal line capac    


b king results. Th ntlel w f


ts pe   


maint in stable product vity      


afer sheet rem 


t


a er sheet p r minute fe sh et


Gentlle va uumtakake-offoff r 


         


 ementbhw@b t.bhwl@buhllerg up.com ergroupc   n wafer hee qua tyality      


ach s 80wafe she 


sheheet thickness, while adjusdjustable bu ne uniformbak g en b e


bakiing plalates he p n he va


elp ensur


acuum ke al


 is des gned o e uirin high onsist nt


si e for


sten ly hig 


ersion with 160 bak fer h ets pe mnute apacity of up to 1,600 kg 


k-


er mi ute g


burners su  


re con tant s ppor


onst nt rt


um take-off drum mova at high speed tivity..


ds gh


Innovations for a better world.


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