Feature: Thermal management


(lower setpoint) results in a slower rate of defect formation, less electromigration and a significant reduction in catastrophic optical damage (COD) and mirror (facet) damage. Te TEC control temperature varies because different lasers have


different thermal sensitivities, application wavelength tolerances and reliability vs power trade-offs. Telecom lasers demand tight wavelength lock; pump lasers can run hotter and ultra-stable sensing lasers oſten run cooler. Higher operating temperatures may be acceptable for some


applications, optimising overall power efficiency. Manufacturers and design engineers routinely balance these trade-offs, factoring customer requirements and deployment environment into each transceiver solution. For example: if the ambient temperature is 50°C, holding a laser at 20°C requires a TEC to pump out a lot more heat than holding it at 35°C. In summary, the trade-off is: Longevity and stability (cooler is better) vs system power efficiency (warmer is cheaper).


Advanced thermal strategies for better stability Shrinking form factors and rising heat fluxes have resulted in the development of new micro and ultra-miniature TECs, such as the MBX series; see Figure 6. Tese devices feature high packing fractions, thin profiles, fast response to temperature changes for precise wavelength control, and scaleable manufacturability for cost-efficient production. Micro thermoelectric coolers respond rapidly to transient thermal loads for precise wavelength control in highly integrated and miniaturised pluggables. Micro TECs also lower thermo-mechanical stress resulting in less heat cycling, easing fatigue in solder joints, bonds and package interfaces, and improving long-term stability.


TECs: Engineered to order Not all 800G modules are created equal! Te combined parameters of laser count, photonic technology used, optical reach of the module, modulation format, form factor and temperature requirements collectively determine the uniqueness and complexity of the cooling requirement; see Figure 7. An engineered-to-order TEC is required to precisely match the specific thermal and spatial requirements of each transceiver variant, optimising performance, reliability and lifetime. An engineered-to-order TEC solution will optimise the


geometry, thermal resistance and power consumption for the specific use case. Tis tailored approach can deliver up to 12%


Figure 6: The MBX series, consisting of new micro and ultra-miniature TECs


efficiency improvements over base product designs which will directly benefit data centre operators seeking lower operating costs and higher reliability. Temperature control systems must further safeguard optical alignment (focus driſt and filter performance) by stabilising package baseplate and TEC setpoints. Tis prevents coupling losses, unwanted reflections and catastrophic optical damage. Te market will continue to favour both standard and highly engineered TECs, balancing cost, footprint and energy consumption, depending on deployment scale, performance requirements and environmental constraints.


The defining challenge Termal management has emerged as the defining challenge in the evolution of AI, cloud computing and telecom pluggable transceivers, as device densities, power requirements and speed targets accelerate. Trough advanced thermoelectric cooling, engineered-to-order designs and creative system-level strategies, leading manufacturers and operators can ensure stable performance, long component lifetimes and efficient energy usage in next-generation setups. As AI and cloud applications demand faster, more reliable data pathways, innovation in optical transceiver technology and thermal management will remain closely intertwined. Te synergy between cutting-edge cooling technologies and high-speed optical communications will sustain industry innovation well into the future, enabling the performance and reliability demanded by tomorrow’s cloud and AI infrastructure.


Figure 7: Many parameters together determine the uniqueness and complexity of the cooling requirement


www.electronicsworld.co.uk November 2025 33


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