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Contents Regulars


04 Technology 06 Cover story 08 Column: From the analysts 10 Focus 12 Column: Embedded design


NEW REGULAR COLUMN 14 Silicon systems design


18 Column: Design with frequency components


40 Products


42 Supplier’s guide / Web locator


COVER SUPPLIED BY INSULATED WIRE MORE ON PAGES 6-7


Features


20 A new era of distributed intelligence By Astute Group engineers


22 Designing a wireless power transfer system with AC rated current By Deepthi Poonacha, Design Engineer in the Custom Magnetics department at Würth Elektronik, and Christian Merz, Design Engineer and Technical Lead, Wireless Power Transfer at Würth Elektronik


26 The important role of active balancing in battery management systems By Frank Zhang, Applications Engineer, Analog Devices


36 Modern motion control feedback devices deliver the biggest gains By George Yundt, Chief Engineer, Servo Technology at Kollmorgen and Jiří Duroň, Product Line Manager at Kollmorgen


Follow us on Twitter


@electrowo


30 Thermal management in AI, cloud and telecoms setups


By Andrew Dereka, Thermoelectrics Product Director, Tark Thermal Solutions


Join us on LinkedIn


34 Supercaps: Where energy meets effi ciency


By Dieter Eßlinger, Product Launches and Sales Coordination, Leuze Electronic


EDITOR: Stella Josifovska Tel: 01732 885810 Email: sjosifovska@datateam.co.uk


SALES: Richard Setters Tel: +44 (0)7794 805307 Email: rsetters@datateam.co.uk


PRODUCTION/DESIGN: Tania King Email: tking@datateam.co.uk


ISSN: 1365-4675 PRINTER: Buxton Press Ltd


SUBSCRIPTIONS: Subscription rates: 1 year digital only - £40


1 year print & digital (UK only) - £75 1 year print & digital (Overseas) - £180 Email: datateam@c-cms.com www.electronicsworld.co.uk/subscribe


15A London Rd, Maidstone ME16 8LY, United Kingdom


www.electronicsworld.co.uk Specialist high-performance


cables by Insulated Wire more on pages 6-7


November 2025 Volume 130 Issue 2051 £5.90


IN THIS ISSUE: • System design • Power


• Thermal management • Components


Regular columns: • From the analysts • Embedded design


• Design with frequency components


New column


SILICON SYSTEMS


DESIGN on p14-16


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