Column Mitigating Supply Chain
Obsolescence: Ball Grid Array Packaging for High Pin Count Products Ensuring long-term component support with onshore BGA assembly
the package solder balls. This eliminates wirebonds in the package, enabling higher performance. These substrates are manufactured in panel form which comprises a grid of substrates. This allows multiple units to be processed in parallel through assembly operations. When these operations are completed, the panel is sawn into the final components. The bottom of the package is the array of solder balls connecting the IC to the PCB through surface mount technology. These solder balls replace the electrical pins of the PGA. Rochester has invested in BGA assembly capabilities in our
F
or products with higher pin counts, the industry is migrating toward substrate-based BGA packages. T ese assemblies provide enhanced performance, better heat dissipation, and more effi cient use of space on circuit
boards, making them ideal for complex, high-performance applications. In this article, Rochester Electronics’ explore the critical shiſt to BGA technology and its implications for future manufacturing trends.
Why Substrate BGA packages? Array packages, initially introduced with PGA, and now commonly realised with BGA, are the key enabler to products needing a high number of signals coming in and out of the package. When connecting to the Printed Circuit Board, (PCB), with an array of connections underneath the package body, rather than a row of connections along each side of the package, the package’s area per signal is signifi cantly reduced. Array packages successfully connect hundreds of signals from the IC to the PCB. Having established the signal density benefi t of array packages
versus dual in-line (DIP) or quad fl atpack (QFP), let’s touch on the migration from PGA to BGA. T e core mechanical diff erence is that the BGA is connected to the PCB with surface mount technology, whereas the PGA is connected to the PCB with through-hole technology. T e manufacturing costs, due to automation and complexity, favour surface mount technology. Additionally, the assembly process of the BGA component is simpler, and thus lower cost. T e BGA is based on a substrate on which the IC die is mounted, designed to route IC bond pad signals to solder ball connections in the array. T e BGA package can accommodate either wirebonded or fl ip-chip die, as needed for each specifi c product. In the case of flip-chip, much of the routing is accomplished
on the die with the redistribution layer to the bumps, with minimal routing required within the BGA substrate to reach
40 November 2024
www.electronicsworld.co.uk
Newburyport, Massachusetts, manufacturing facility to address this industry need. We are positioned to support a wide range of package sizes and ball count BGA packages. We can assist customers wishing to migrate their product from one of the older PGA or QFP package formats to the BGA. T is is accomplished through assembly of the customer die in a BGA package and testing of those components. T is migration from PGA or QFP can be done in a custom BGA at Rochester, allowing the customer to preserve more board-level signal integrity analysis by keeping signal routes the same. T is is another piece of keeping our customers’ systems shipping with minimal or no change to the hardware and no changes to their soſt ware.
Package, Substrate, and Lead frame Replication T e industry moved away from lead frame assemblies primarily because technology performance demanded zero wire bonds, and the costs to continue lower volume lead frame assemblies were overwhelming. Rochester Electronics is aware of and anticipated these trends
and simultaneously invested in both lead frame assemblies as well as substrate based QFN and BGA assemblies. With billions of die and wafers under storage and most of them requiring lead frame assemblies, it certainly was a logical decision to do so. Not only is Rochester investing in expensive trim and form options for PLCC packages no longer available from the largest assembly house in the world and is quickly exiting from many others, but we have amassed a long-term US-based assembly factory that can support almost all assembly types in existence. Rochester’s Package, Substrate, and Leadframe Replication
Capabilities include: • Ability to re-introduce most package technologies • ROHS/SnPb lead fi nishes available • JEDEC and custom package outlines • Substrate and leadframe design services are available • Qualifi cation services available
For more information visit:
www.rocelec.com
https://www.rocelec.com?utm_medium=Editorial&utm_source=ElectronicsWorld&utm_campaign=NOV25ElectronicsWorldEditorial&utm_content=Obs_BGA_article
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