Feature: Thermal Management
What is Thermal management? challenges and solutions By Rajesh Manish, associate manager, Semiconductor Business Practices
T
hermal management is a critical element in all Gapes Of electronic equipment. Tere are three general aspects to thermal management;
heat transfer, temperature measurement, and the management of the coefficients of thermal expansion of various materials and components used in an electronic assembly. Termal management involves applying the science of heat transfer to maintain the operating temperature of the equipment within acceptable bounds. Te ongoing trend of the radical
miniaturisation of electronic devices is expected to fuel the growth of the thermal management market. Likewise, growing strictness regarding emission regulation is expected to offer lucrative opportunities for the thermal management market players. However, the increasing development costs of customised thermal management
solutions and systems are expected to hamper the market growth. Te global thermal management market was valued at USD 10.7 billion in 2022 and is projected to reach USD 19.3 billion by 2028, registering a CAGR Of 9.7 per cent during the period. Te rising demand for thermal management is attributed to the increasing need for advanced heat dissipation solutions. Product launches are the key strategy
adopted by major players in the thermal management market for the past few years. Besides this strategy, companies are also adopting several other growth strategies such as partnerships, collaborations, and acquisitions to increase their market share. Te automotive segment is expected to
witness the highest CAGR in the thermal management market from 2023 to 2028. Te increasing use of thermoplastics in automobiles is leading to a rise in demand for thermal management solutions and the rising demand for electric vehicles is drawing more
need for thermal management solutions. Te wheel movement of electric vehicles is motor driven and the working temperature of the electric motor is critical for the performance of the vehicle. With increasing load, the motor draws more power from the battery and heats up. Te batteries are being packed into electric
vehicles with footprints that can be the same. Due to this, more heat being generated than ever in engines and automotive components. Te cooling of the motor is necessary for its full performance in electric vehicles. Tese factors are expected to drive the market for the automotive segment. Advanced cooling devices are expected to witness the highest CAGR in the thermal management market from 2023 to 2028. Te growth of this segment can be attributed to the increased adoption of microchannel cooling, cold plate cooling and direct immersion cooling devices. Te thermally conductive plates provide
the most effective way to optimise the contact of the liquid with the surfaces ,as they enable the highest level of heat transfer. Tis is due to the flow of the liquid through layers of thermally conductive sheets. Direct immersion cooling is Widely used in servers & data centres. In this process, servers are immersed in a nonreactive fluid or coolant for thermal cooling. Tus, eliminating the requirement for heat fans and heat sinks. Te Pacific region accounted for the largest share of the thermal management market in 2028. Asia Pacific is one of the leaders in the
semiconductor chip manufacturing sector, due to the presence of companies such as; SK Hynix Inc. (South Korea), Renesas (Japan), Toshiba Corporation (Japan) and Samsung (South Korea) in countries such as China, Japan, South Korea, and Taiwan. Moreover,
32 November 2024
www.electronicsworld.co.uk
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