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NXP complies with new standard for automotive cybersecurity
NXP CYBERSECURITY engineering processes are now certified as compliant with the new automotive cybersecurity standard ISO/SAE 21434.
NXP is said to be the first semiconductor supplier to be certified by TÜV SÜD to comply with the latest
automotive cybersecurity standard ISO/SAE 21434. The new automotive cybersecurity standard aims to provide connected vehicles with robust protection from malicious cyberattacks. The standard requires OEMs and their supply chains to apply a security-by-de- sign approach to their components, servers, and processes to reduce the risk of being vulnerable to attacks at any point in the vehicle lifetime, from the initial concept and design phases to end of life. From July 2022 onward, vehicle manufactur- ers (automotive OEMs) must comply with the R155 automotive cybersecurity regulation for new vehicle type launches in Europe, Japan and Korea, which represents over a third of global vehicle production. Other regions are expected to follow. The standard ISO/SAE 21434 supports the implementation of the R155 requirements
in organizations across the supply chain. NXP’s ISO/SAE 21434 certification helps enable OEMs to meet requirements of the R155 regulation. The existing policies and processes of NXP have been refined and extended to fully meet the requirements of the new standard ISO/ SAE 21434. The assessment and certification were conducted by TÜV SÜD. TÜV SÜD audited NXP’s organization, its policies and processes for compliance with new standard ISO/SAE 21434. “With the increasing number of connected vehicles and technologies, it puts security at the forefront,” said Claudio Gregorio, department manager functional safety and cybersecurity at TÜV SÜD. “The certification facilitates the security by design approach, enhancing trustworthiness and reducing complexity across the complex automotive supply chain.”
Euroquartz to launch UK manufactured surface mount clock oscillators at EDS 2021
FREQUENCY CONTROL SPECIALIST EUROQUARTZ is to launch a new range of UK manufactured surface mount clock oscillators capable of up to 3000G shock survivability with extended industrial temperature range on stand F2 at the Engineering Design Show (EDS) 2021 (19-20 October, Coventry Building Society Arena). The new components are being manufactured in the company’s class 7 cleanroom facility and frequencies are available from 2.0 to 60MHz.
The new EQXO-75UIE oscillator is a ruggedised LVCMOS-compatible circuit with a miniature quartz crystal housed in a low-profile ceramic surface mount package measuring 7.0 x 5.0 x 1.4mm. Designed by Euroquartz for demanding industrial applications, it will provide reliable operation with good frequency stability across an extended industrial operating temperature band from -40 to +105°C. Utilising the latest advances in production technology, the combination of optimised design and high-quality materials provides a high reliability clock oscillator suitable for industrial applications. Available with +2.5 and +3.3V (±10%)
supply voltage options, additional features include superior phase noise performance with femto second phase jitter of 150fs (typical) and custom crystal pre-ageing options available. A further advantage of these UK-manufactured components is that they are free from ITAR regulations with reduced shipping costs. In addition, customers can visit the production facility without facing long haul flights.
Molex reveals findings from ‘The Future of Mobile Devices’ survey
A GLOBAL SURVEY has identified the top trends and technologies that will impact smart phones, smart wearables and other mobile devices manufactured in 2026. Molex, a global electronics leader and connectivity innovator, commissioned Dimensional Research to conduct The Future of Mobile Devices global survey in July 2021, polling 207 qualified participants representing mobile device OEMs and suppliers. Questions were asked to identify the features and timeframes for future mobile devices, as well as gauge the growing impact of 5G and connectivity innovations, along with barriers impeding overall progress. No unanimous description emerged of a
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typical mobile device in 2026. However, the top-five disruptive features most anticipated, and ranked in order, by respondents are self- charging; holographic or projection displays; fully recyclable; environment-proof, such as dust- or waterproof; and no-break displays. Time will tell which features will become standardized in five years, if ever. While 90 per cent of those polled expect mobile devices to take on different form factors (e.g., screen size, shape, etc.), there wasn’t consensus on whether they would be smaller, larger or different altogether. Nearly two-thirds believe demand for novel wearables will grow, including smart clothing (40 per cent), glasses (33 per cent), earpieces
(29 per cent) and watches (29 per cent). Typical consumers will likely have more specialized devices by 2026, according to two- thirds of those polled. Still, 64 per cent believe smartphones with integrated capabilities will minimize or replace the need for tablets. Respondents were also asked to rank up to five of the top features poised for the greatest amount of innovation in mobile devices manufactured in 2026. They cited data connectivity (42 per cent), followed by wireless charging (36 per cent), cameras (33
per cent), Wi-Fi connectivity (28 per cent) and built-in speakers (28 per cent). Additionally, 82 per cent expect consumers to reap significant benefits from 5G-enabled mobile devices by 2026. Ultra-fast 5G or mmWave ranked first (42 per cent) in enabling technologies forecasted to drive disruption in mobile device manufacturing, followed by two-way wireless charging, optical waveguides for smart glasses, cameras with wafer-level optics, and nanoscale or micro- scale components.
Among mobile device OEMs and their suppliers, technology challenges remain that could impact plans for building future mobile devices. According to the survey participants, the most difficult problems to address are performance of 5G cellular connectivity (37 per cent), high-speed wireless charging (37 per cent), battery life (36 per cent), sustainability (35 per cent) and inability to produce small components at micro or nano scale (27 per cent).
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