Industrial
True 3D inspection is a game changer to big data
The use of Automated Optical Inspection (AOI) and 3D Solder Paste inspection (SPI) systems are popular methods of printed circuit board assembly (PCBA) assessment. Their use is becoming ever more important as the requirement for miniaturised PCBAs and the dense, intricate circuitry used within them requires careful inspection to ensure reliability
Measurement accuracy
AOI is the automated visual inspection of PCBA manufacture which uses a technology (Camera/ Laser/Light) to scan the assembly for defects that could lead to board failure. It can be used at many stages through the manufacturing process including bare board inspection and populated board inspection (pre and/or post reflow). SPI monitors solder paste deposits including its alignment and volume during the manufacturing process. These systems are increasingly important for electronics manufacturers because they help ensure high quality production results and improve reliability, quality and performance of the PCBA.
importance of reliability a priority, manufacturers want to monitor and adapt the process to achieve zero defects by consistently accessing all the data. Furthermore, manufacturers require process optimization which has been difficult to achieve for 2D, 2.5D, and quasi True 3D systems that cannot reliably offer accurate information by providing real “True 3D” data. It is also impossible for these systems to accurately detect, measure and quantify shape, coplanarity changes and solder amount. To overcome these challenges a True 3D light measurement system is required to measure every aspect of the component and solder joint generating a significant set of reliable and accurate measurement data.
“The rise in inspection systems was originally positioned as a form of safety net to capture PCBAS not matching a comparative ‘gold standard’ product,” explains Joe Booth, CEO, Altus Group.
Measurement accuracy has always been important within the electronic assembly industry but with the decreasing geometry of components used in modern electronic assemblies, and the need to offer 100% reliable and traceable processes for critical applications their importance is growing.
While most manufacturers base quality decisions on a “good-bad” comparison of reference images, variables like surface finish, board condition, and component proximity can easily influence these image-based decisions. Data generated from 3D light measurement systems, however, supplies meaningful insights about the process and can help manufacturers eliminate the root cause of a defect. As such, manufacturers must trust the data from the system and use that data to help transform, monitor and control the PCBA process. However, for these systems to make the leap from inspection to process control, and ultimately to automated process optimisation, the data must be reliable, repeatable and relatable. With speed to market of the essence and the
16 September 2021
“Escapes and faults from production can be caught before they get to the customer and damage credibility which would eventually affect company profits. Intelligent companies invested in Solder Paste Inspection (SPI) because 84% of production faults are caused by solder errors. However, more companies invested in AOI as a fault finder once the board had been populated. “Hardware has moved on; computing power has grown exponentially and the number of sensors in inspection machines has matched this growth in computing power. This has resulted in more accurate machines, with the ability to collect more data. This in turn has culminated in detailed information now available to judge if the board is of a satisfactory standard based on the
‘gold standard’ board/programme. Automated 3D AOI and SPI have been a game changer in reliable electronics ensuring the intricate PCBAs within these complex components are fail safe. “One company that is trailblazing this ideal in automated 3D inspection is Koh Young. Since the Koh Young systems use light measurement, they produce the most accurate measurements of a PCBA, therefore it can be used to set the tightest tolerances. This results in better quality inspection, PCBAs and a large reduction in false calls. Thanks to this intelligent automated technology which has the highest level of connectivity for all the inspection stations, overall automation capability is enhanced and the Industry 4.0 ideal is met.”
Highly reliable
Data, especially from inspection and test systems, is the foundation for Industry 4.0 and Smart Factories, so advanced systems must evolve from simply judging “Pass/ Fail” situations into highly intuitive, dynamic decision-making systems. This emphasises the need for reliable, repeatable, and relatable data. Artificial Intelligence (AI) engines can empower systems to help manufacturers analyse and optimise the PCBA process by managing process data from connected SPI, pre-reflow AOI, and post-reflow AOI systems. Ideally, the AI system collects all inspection and measurement data from equipment in the line, and then delivers information anywhere within the network with an intuitive, web-based user interface.
Improving metrics The machine to machine (M2M) communication
standards, guided in part by Industry 4.0, are altering the manufacturing process by improving metrics like first pass yield and throughput with autonomous process adjustments that increase board quality and reduce production costs. As part of this path, certain process control software suites like KSMART from Koh Young can revolutionise data collection and analysis, and more importantly PCBA process optimisation. KSMART analysis solution collects all inspection and measurement data from all equipment with its KSMART hub. Adept equipment supplies can then apply the data set to proprietary AI engines for continuous performance improvement.
The advantage of this analytical tool is traceability. KSMART helps advanced inspection systems evolve from “Pass/Fail” tools into highly intuitive, dynamic decision-making systems. KSMART ensures the highest levels of transparency by showing all conditions of the lines, while providing the required documentation for changes to the job file, package, part, and more.
Crucial data
Suppliers must measure the true 3D information of components and solder joints. If properly accomplished, the AOI can offer very valuable data, thus, becoming the most reliable “sensor” on the line. Companies can only guarantee the validity of 3D data if the system uses True 3D measurement technology to extract the exact body dimensions for all component types. The combination of multipoint measurement and process data collected from SPI, pre-reflow AOI, and post-reflow AOI systems, combined with data from printers, mounters, and reflow ovens will allow manufacturers to deliver an AI- powered, zero defect, self-healing line. Using True 3D measurement data generated during multipoint inspection helps manufacturers define the source of inefficiencies and boost line efficiency. These inspection solutions are laying the foundation for a smart factory, while revolutionising process optimisation.
www.altusgroup.co.uk Components in Electronics
www.cieonline.co.uk
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