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u-blox launches u-center 2 GPS evaluation software
Renesas introduces 32-Bit RX671 MCUs
RENESAS ELECTRONICS CORPORATION, the supplier of advanced semiconductor solutions, has introduced the RX671 group of 32-bit microcontrollers (MCUs), adding a new high-performance, high-functionality single-chip solution with touch sensing and voice recognition capabilities for
U-BLOX, a global provider of positioning and wireless communication technologies and services, has launched its global navigation satellite system (GNSS) evaluation software, u-center 2. The software, which runs on Microsoft Windows, offers anyone working with tenth-generation u blox GNSS technology a highly intuitive interface to configure GNSS products, evaluate their performance, improve the quality of their software, and experience the performance boost achieved using GNSS- related services.
u-center 2 is the successor to the u-blox u-center GNSS evaluation software. Fully compatible with the latest u blox M10 GNSS technology, u-center 2 is designed from scratch to offer improved overall performance, as well as feature additions that simplify the configuration, evaluation, and software development of GNSS-based solutions.
u-center 2 provides personalized workspaces with adaptive window elements offering a choice of views to observe static and dynamic behaviour of the connected GNSS receiver. The built-in log player, which accepts log files from the previous version of the software, features easy message- and time-based navigation and lets users set the playback speed, making the development of end products more efficient. Automatic updates ensure that the software always includes the latest features with minimal user effort. Additionally, u-center simplifies the evaluation of the growing portfolio of GNSS-related location services. This includes AssistNow, through which GNSS receivers gain access to GNSS aiding data, enhancing startup performance, and saving power. u-center 2 is free for download at
www.u-blox.com/en/product/u-center.
contactless operation to the RX Family. Part of Renesas’ mainstream RX600 Series, the RX671 MCUs are built
around an RXv3 CPU core operating at 120 MHz and integrates flash memory supporting fast read access at a clock speed of 60 MHz, for impressive real-time performance with a CoreMark score of 707, and power efficiency among the best in the class at 48.8 CoreMark/mA.
Available in a wide variety of packages with pin counts ranging from 48 to 145 pins with up to 2 megabytes (MB) of flash memory and 384 kilobytes (KB) of SRAM, the RX671 MCUs are suited for a wide range of applications that require advanced functionality, power efficiency, and compact size, such as heating, ventilation, and air conditioning (HVAC), smart meters, and smart home appliances. For size-constrained devices that require advanced functionality, the RX671 is available with 2 MB of flash memory in a 64-
health and safety requirements that are transforming how people interact with their devices and environments, increasing the demand for hygienic contactless user interfaces in particular. The new RX671 MCU is optimized for contactless applications, integrating a capacitive touch sensing unit that combines high sensitivity with excellent noise tolerance and can be used to implement contactless proximity switches. In addition, the serial sound interface can be used to connect digital microphones that support voice recognition over long distances. Used in combination with voice recognition middleware from Renesas’ RX ecosystem partners, these features enable developers to create contactless operation functions utilizing voice recognition in a short amount of time.
pin TFBGA package measuring only 4.5 mm × 4.5 mm – among the smallest anywhere among MCUs with 2MB flash memory. The COVID-19 pandemic created new
X-FAB to offer high-volume micro-transfer printing capabilities
X-FAB SILICON FOUNDRIES, the foundry for analog/ mixed-signal and specialty semiconductor solutions, is now able to support volume heterogeneous integration via Micro-Trans- fer Printing (MTP), thanks to a licensing agreement that has just been secured with X-Celeprint. This will mean that a diverse range of semiconductor technologies may be combined together, each being optimized for particular functional requirements. These will include SOI, GaN, GaAs and InP, as well as MEMS.
In order to provide customers with MTP-based heterogene- ous integration, X-FAB has made substantial investments over the last two years. It has also established new optimized workflows and cleanroom protocols. This will allow customers to work with the foundry on heterogeneous design projects – benefitting from a low-risk and fully scalable business model that offers a clear migration to volume production.
6 September 2021 Components in Electronics
X-Celeprint’s proprietary massively-parallel pick-and-place MTP technology stacks and fans-out ultra-thin dies based on different process nodes, technologies, and wafer sizes. It results in the formation of virtually monolithic 3D stacked ICs, which
www.cieonline.co.uk
have enhanced performance, greater power efficiency, and take up less space. Furthermore, all this can be achieved at an accelerated rate, thereby shortening time-to-market. “By licensing X-Celeprint’s disruptive MTP technology, we are uniquely positioned in our ability to facilitate the incorporation of numerous different semiconductor technolo- gies. X-FAB customers will be able to utilize a technology that no other foundry is offering, and existing X-Celeprint customers may now tap into capacity levels that will easily meet their future demands,” Volker Herbig, VP of X-FAB’s MEMS business unit, said. “As a result, we can assist customers looking to implement complete multifunctional subsystems at the wafer level, even when there are high degrees of complexity involved. Signal conditioning, power, RF, MEMS, and CMOS sensors, optoelectronic devices, optical filters, and countless other possibilities will all be covered.”
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