search.noResults

search.searching

dataCollection.invalidEmail
note.createNoteMessage

search.noResults

search.searching

orderForm.title

orderForm.productCode
orderForm.description
orderForm.quantity
orderForm.itemPrice
orderForm.price
orderForm.totalPrice
orderForm.deliveryDetails.billingAddress
orderForm.deliveryDetails.deliveryAddress
orderForm.noItems
Front End | News


Rambus advances HBM2E performance to 4.0 Gbps for AI/ML training applications


R T


ambus Inc announced it has achieved a record 4 Gbps performance with the Rambus HBM2E memory interface solution consisting of a fully-integrated PHY and controller. Paired with the industry’s fastest HBM2E DRAM from SK hynix operating at 3.6 Gbps, the solution can deliver 460 GB/s of bandwidth from a single HBM2E device. This performance meets the terabyte-scale bandwidth needs of accelerators targeting the most demanding AI/ML training and high- performance computing (HPC) applications.


“With this achievement by Rambus, designers of AI and HPC systems can now implement systems using the world’s fastest HBM2E DRAM running at 3.6 Gbps from SK hynix,” said Uksong Kang, vice president of product planning at SK hynix. “In July, we announced full-scale mass-production of HBM2E for state-of-the-art computing applications demanding the highest bandwidth available.”


The fully-integrated, production-ready Rambus HBM2E memory subsystem runs at 4 Gbps without PHY voltage overdrive.


Rambus teamed with SK hynix and Alchip to implement the HBM2E 2.5D system to validate in silicon the Rambus HBM2E PHY and Memory Controller IP using TSMC’s N7 process and CoWoS® (Chip-on-Wafer-on- Substrate) advanced packaging technologies. Co-designing with the engineering team from Rambus, Alchip led the interposer and package substrate design.


“This advancement of Rambus and its partners, using TSMC’s advanced process and packaging technologies, is another important achievement of our ongoing collaboration with Rambus,” said Suk Lee, senior director of the Design Infrastructure Management Division at TSMC. “We look forward to a continued partnership with Rambus to enable the highest performance in AI/ML and HPC applications.” “Alchip brought a demonstrated track record of success in 7nm and 2.5D package


design to this initiative,” said Johnny Shen, CEO of Alchip Technologies. “We’re extremely proud of our contributions to Rambus’ breakthrough achievement.” “With silicon operation up to 4 Gbps, designers can future-proof their HBM2E implementations and can be confident of ample margin for 3.6 Gbps designs,” said Matthew Jones, senior director and general manager of IP cores at Rambus. “As part of every customer engagement, Rambus provides reference designs for the 2.5D package and interposer to ensure first-time right implementations for mission-critical AI/ML designs.” rambus.com


NCC Connectors suit applications with restricted space and offer high protection


he Series 670 NCC Subminiature Connectors expand the binder product range with a system for applications with restricted space. The newly developed products target the growing need for suitable, reliable circular connectors in many applications including lighting and test and measurement instrumentation. The Series 670 are 5-pin subminiature connectors with a bayonet closure and a cable bushing from 3.5 to 5.0mm. The flange-type socket is provided with soldered and dip-soldered contacts. A key feature of these connectors is that the contacts are completely protected against water, dirt and penetration by foreign objects when not connected. The NCC (Not Connected


Closed) connectors use a spring cover to protect the contacts even when disconnected. With the NCC system, the Series 670 achieves protection to IP 54 when not connected. When the subminiature connector is connected, the level of protection increases to IP 67. The core function of the NCC feature from binder keeps the contacts free from environmental effects and is also distinguished by its high durability. Sascha Döbel, product manager at binder, explains, “Our NCC subminiature connectors are designed for more than 1000 mating cycles. With this flexibility and long life combined with the additional characteristics of the Series 670, we put the focus on the increasing demands of a growing group of users.”


Users with applications that demand frequent mating and demating will appreciate Series 670 subminiature connectors as will those users who need connectors with a compact profile for applications with the restricted space.


In addition to the key feature of environmental protection, the Series 670 plastic socket impresses with its high


resistance to vibration and shock loads. The product is also particularly resistant to heat and cold with an operating temperature range from -25°C to +85°C. binder has made available connector housings in different colours which is ideal for those applications where identification and organization is important. binder-connector.com


Telonic Instruments teams up with Microtest M


icrotest Corporation signs a UK distribution agreement with test instrument and power supply specialist,


Telonic Instruments. Microtest’s extensive test and measurement portfolio is now available in the UK from Telonic Instruments. Founded in 1993, Microtest has established itself as a supplier of high precision and automatic measuring equipment for customers in the electronics, information and communications industries. The ISO-9001-certified company holds many patents and has received R&D and innovation awards for their products.


6 October 2020


Microtest’s extensive portfolio includes component testers – including LCR meters, impedance analysers and DC bias current test systems; safety testers, including Hipot testers; transformer testers, cable and motor testers and automatic test equipment, together with a wide selection of fixtures and accessories.


Components in Electronics


Telonic Instruments’ managing director, Doug Lovell, commented on the Microtest signing: “We are pleased to be teaming up with such a prestigious company, which is a leader in its field,” he said. Partnering with Telonic Instruments will develop the business, agrees Mike Chou, CEO of Microtest. “It’s been a great start,” he observed. “Working with Telonic Instruments is going to increase Microtest competitiveness in the UK electronics measurement market,” he added. There is a special promotion running until the end of 2020: a 15% discount on the


price of two Microtest LCR meters, the LCR Meter 6365 and LCR Meter 6366. The LCR Meter 6365 and LCR Meter 6366 are ideal for synchronous tests in production lines, automated testing, quality assurance and incoming quality control. Both have multi-step functions, USB storage and basic accuracy of ±0.05%. The LCR Meter 6363 operates at 10-200kHz and the LCR Meter 6366 operates at a frequency range of 10-500kHz. telonic.co.uk


www.cieonline.co.uk


Page 1  |  Page 2  |  Page 3  |  Page 4  |  Page 5  |  Page 6  |  Page 7  |  Page 8  |  Page 9  |  Page 10  |  Page 11  |  Page 12  |  Page 13  |  Page 14  |  Page 15  |  Page 16  |  Page 17  |  Page 18  |  Page 19  |  Page 20  |  Page 21  |  Page 22  |  Page 23  |  Page 24  |  Page 25  |  Page 26  |  Page 27  |  Page 28  |  Page 29  |  Page 30  |  Page 31  |  Page 32  |  Page 33  |  Page 34  |  Page 35  |  Page 36  |  Page 37  |  Page 38  |  Page 39  |  Page 40  |  Page 41  |  Page 42  |  Page 43  |  Page 44  |  Page 45  |  Page 46  |  Page 47  |  Page 48  |  Page 49  |  Page 50  |  Page 51  |  Page 52  |  Page 53  |  Page 54