Sensor Technology ASIC, SoC and SiP — which do you choose?
Manufacturing continues to grow digitally in 2023, with a report by Valtech revealing that almost half of manufacturers have increased their digital related budgets by up to 20 per cent this year. An important investment for any digital strategy is smart sensors. But as technology grows in sophistication, how can we push even more functionality into shrinking devices, all for a reasonable cost? Here, Richard Mount, director of sales at ASIC design and supply company Swindon Silicon Systems, breaks down the ASIC, SoC and SiP integrated circuits (ICs) integral to smart manufacturing
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erforming tasks such as signal conditioning, applications and processing of output, an IC is integral to smart sensor function. Acting as the sensor’s neural hub, the IC is tasked with converting physical input into meaningful electric signals before processing them for further use. It’s important to note that the specifi c architecture, design and functionality of a custom IC depend on the application it is intended for. When seeking to add more functionality into a device, a manufacturer is bound to have a wish list of questions: what if the sensor can be made more sophisticated? How about conditioning the data and making the sensor response more linear? Calibrating the data to counter the effects of temperature, for example? Depending on the manufacturer’s requirements, there are several IC options that could meet their needs.
Why choose an ASIC? Unlike general-purpose ICs such as microprocessors or memory chips, which are designed to perform a wide range of functions, application specifi c integrated circuits (ASICs) are customised to perform a specifi c function or set of functions.
The design process of an ASIC involves
translating the functional requirements of its destined application into a detailed circuit design. ASICs can include a wide range of circuit elements, such as digital logic gates, memory blocks, analogue circuits, input/output interfaces and more, depending on the specific application needs.
By tailoring the circuitry to the specifi c requirements of the application, ASICs can achieve faster processing speeds, lower latency and higher effi ciency. They can also be designed to minimise power consumption, making them well-suited for applications with strict power constraints and to fi t specifi c form factors and integration requirements.
When to use System on Chip When designing an ASIC, it often makes sense to integrate other parts of the circuit schematic onto the same silicon die. This is known as a System on Chip (SoC).
SoC combines various functional blocks such as processors, memory, input/output interfaces, analogue circuits, digital logic and other peripherals required for the application at hand. The key characteristic of SoC is its high level of integration, which eliminates the need for separate chips for a simplifi ed design, manufacturing and assembly process. There are some key differences between an ASIC and a SoC. The principal aim of an ASIC is to tailor functionality to a specifi c application. While SoC also delivers a high level of specialist functionality, the main driver for a SoC is to integrate multiple subsystems onto a single chip. SoC can often be more scalable too, as programmable components such as CPU cores can be reprogrammed or reconfi gured to support different requirements as needed.
An introduction to System in Package However, sometimes it is not possible to integrate all the system features into a single die and this is where a System in
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Package (SiP) becomes favourable. A SiP is typically an ASIC in bare die form that’s integrated with another IC, for example a microelectromechanical sensor (MEMS) or a communications die such as BLE, all in a single package. The ASIC provides the signal processing and sensor interface, while the MEMS acts as the sensing element and the BLE for a complex communications protocol. SiP technology
enables various benefi ts, including improved system performance, reduced power consumption, enhanced reliability, and increased functionality. It enables the integration of diverse technologies, such as digital, analogue, radio frequency (RF), and even MEMS, into a single package.
By combining multiple components into a single package, a SiP can provide advantages such as shorter interconnect lengths, reduced parasitic effects, and improved signal integrity. It also simplifi es the manufacturing and assembly processes, reducing the overall cost and time required for production. The choice between a SoC and a SiP depends on various factors, including the specific requirements of the application, the level of integration needed and the desired form factor. The best option ultimately depends on the unique requirements of the customer, and working with a specialist will ensure you get the best out of your investment. For a manufacturer wanting to integrate more sophisticated, sensor-driven technology into their product, they may be pleased to know there are several options available at their fingertips. ASIC, SoC and SiP can all offer a multitude of performance gains that will help a product stand out from the competition.
https://www.swindonsilicon.com/ Components in Electronics November 2023 53
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