Front End | News CamdenBoss unveils investment in injection moulding capability C
amdenBoss has officially unveiled its investment in state-of-the-art injection moulding technology, marking its commitment to UK manufacturing and providing a more resilient supply chain to its customers. This investment follows the company’s move in 2021 to the Galaxy Building in Mildenhall, Suffolk, where design, warehousing and manufacturing operations are co-located to meet customer requirements across electro-mechanical components, flat sheet plastic custom enclosures and now injection moulded enclosures.
“The investment in the latest technology is a very important and exciting development for CamdenBoss, which clearly demonstrates our commitment to delivering for our customers,
to manufacturing in the UK, contributing to upskilling our local workforce and reducing our carbon footprint,” said James Buckle, owner of Heathpatch Limited, announcing details of the Mildenhall site investment. The company selected the latest electric Arburg equipment which, along with its recent investment in solar power and reduced transport mileage by manufacturing on-site, significantly reduces the carbon footprint of its operations and accelerates CamdenBoss’ transition to net zero.
Katy Davies, managing director of CamdenBoss, said: “CamdenBoss has been committed to repatriating its injection moulding to the UK for several years, and this investment takes us to the next level of producing as much as possible as locally as
possible to support our growing customer base efficiently, effectively and with greater resilience. It also allows us to develop the skills of our people through apprenticeships while cementing our commitment to reducing our environmental impact.”
CamdenBoss employs 120 people in Mildenhall, Suffolk as a leading UK manufacturer of injection moulded and flat sheet plastic enclosures and e-mech
components. It has over 50 years’ experience in design and manufacture, working with customers and distributors alike to develop innovative solutions for their enclosure design
requirements from product design stage right up to modification.
www.camdenboss.com Radiation-hardened ICs lift off onboard Artemis 1 mission to the moon H
undreds of Renesas Electronics’ radiation-hardened (rad-hard) integrated circuits (ICs), including over 50 different part numbers, are onboard the Artemis 1 launch that blasted off into space on 16th November. Intersil- brand rad-hard ICs are part of the battery management systems, RS-25 engine control electronics and the launch abort system on the Space Launch System that propelled the mission into space, the most powerful rocket ever built. On the Orion Capsule that will circle the moon, Renesas provided critical components for controller boards, the main flight computer, the docking camera system,
the power distribution system and display and panel electronics. The Intersil-brand ICs perform multiple functions, including power management and precision signal processing.
Artemis is the ambitious NASA program that will take humankind back to the moon for the first time in more than 50 years. Artemis 1 is sending the test-mannequin populated Orion capsule
to orbit the moon and deploy cubesats and other space experiments on a 42-day mission to test all the critical systems. Artemis 2 (2024) will have a crew that will orbit the moon paving the way for Artemis 3 (2025), which will land the first woman and the first person of colour on the moon. The plan is for Artemis to continue to build a space station in lunar orbit and a base on the lunar South Pole. This infrastructure will allow for the awe- inspiring goal of a crewed mission to Mars in the 2040s.
www.renesas.com/space Advanced Interconnection_CIE 210x130 ad template 13/10/2021 11:31 Page 1
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