search.noResults

search.searching

saml.title
dataCollection.invalidEmail
note.createNoteMessage

search.noResults

search.searching

orderForm.title

orderForm.productCode
orderForm.description
orderForm.quantity
orderForm.itemPrice
orderForm.price
orderForm.totalPrice
orderForm.deliveryDetails.billingAddress
orderForm.deliveryDetails.deliveryAddress
orderForm.noItems
PCBs


is a central consideration in PCBA rework because modern electronics have a wide variety of sensitive materials.


Key materials at risk Plastics and polymer housings Connectors, component bodies, and sockets may be made from: ● Polycarbonate ● Nylon ● PBT ● LCP


Aggressive solvents can cause cracking, swelling, or embrittlement.


Labels and markings


Rework often involves serialized products. Cleaning fluids must not remove: ● Ink markings ● Barcode labels ● Part identifiers


Conformal coatings


Assemblies may be coated with acrylic, silicone, urethane, or parylene. Some cleaners can soften or delaminate coatings, especially after rework heating.


Sensitive components


MEMS devices, sensors, and optical modules may have exposure limits to certain solvents or cleaning methods.


Solder mask and board laminates Even FR-4 materials can be affected by prolonged solvent exposure or improper drying.


Matching the cleaner to the contamination


Cleaning fluid is not one-size-fits-all. The most successful rework cleaning processes match the cleaner to the specific soil type.


Flux removal requires flux-specific chemistry


Flux residues vary widely. A cleaner that works well on rosin may not work on no-clean polymers.


High-performance solvent cleaners are often needed to dissolve hardened no-clean flux after multiple heat cycles. Water-based saponifers may work for water-soluble flux but require thorough rinsing and drying to prevent ionic residue.


Oils and handling contamination require degreasing power Fingerprints and oils are non-ionic but can interfere with coating adhesion and solderability. Solvent cleaners with strong degreasing properties are typically preferred.


www.cieonline.co.uk


● Ensure complete drying, especially under low-standoff components


The advantage of partnering with a knowledge-driven supplier Choosing the correct solvent is not simply a purchasing decision. It is an engineering decision. Partnering with a supplier that offers extensive application knowledge and advanced testing laboratory facilities can significantly reduce risk in PCBA rework operations.


Vapour degreaser: Controlled vapour degreasing delivers repeatable, residue-free cleaning


Particulate debris requires mechanical assistance


Particles may require cleaning methods that combine chemistry with: ● Controlled spray ● Ultrasonic agitation (where safe) ● High-purity wipes


Chemistry alone cannot remove trapped solder balls under fine-pitch components.


Adhesives and specialized soils require caution


Adhesives, staking compounds, or underfills may not be intended for removal. Cleaning chemistry must avoid degrading these materials, making compatibility testing essential.


Cleaning fluid selection criteria for rework applications When selecting a rework cleaner, manufacturers should evaluate:


Cleaning strength and soil compatibility Does the chemistry dissolve the specific residue present?


Residue-free evaporation


Rework cleaning should not introduce new contamination.


Material compatibility testing Cleaners must be safe for: ● Plastics ● Coatings ● Labels ● Component bodies


Process compatibility Can the cleaner be applied via: ● Brush and wipe


Best practices for PCBA rework cleaning


To maximize results, organizations should implement structured cleaning controls: ● Clean immediately after rework before residues harden


● Use specialty chemistries for each flux type ● Avoid overexposure of plastics to solvents ● Confirm compatibility with coatings and labels


● Inspect under magnification ● Perform ionic cleanliness testing when needed


● Aerosol spray ● Vapour degreasing


Regulatory and safety considerations Modern facilities require compliance with: ● VOC and GWP regulations ● Worker exposure limits ● Regional environmental restrictions Non-flammable, low-toxicity cleaners may improve operational safety.


The role of cleaning in long-term reliability


Cleaning impacts multiple reliability factors, including: ● Electrical insulation resistance ● Corrosion prevention ● Conformal coating adhesion ● Solder joint integrity ● Prevention of electrochemical migration In rework, these risks are amplified because residues have already undergone multiple thermal cycles. A board that passes functional test today may fail months later due to contamination-driven corrosion or leakage currents. Cleaning is therefore not a cosmetic step. It is an investment in product lifespan.


An experienced supplier can conduct material compatibility testing against specific plastics, coatings, labels, and sensitive components. They can evaluate solvent effectiveness on actual flux residues used in your process, perform ionic contamination testing, and confirm cleaning performance under realistic conditions. Laboratory analysis such as surface insulation resistance (SIR) testing, gravimetric analysis, and microscopic inspection can help confirm that the selected chemistry removes contamination without damaging materials.


Beyond testing, knowledgeable suppliers understand evolving regulations, VOC limits, and worker safety requirements. They can recommend chemistries that balance cleaning strength with environmental and compliance needs. Instead of trial-and-error solvent choice, manufacturers gain data-driven proof, ensuring that the cleaner is both effective and safe for the specific assembly.


In complex, high-reliability industries, this level of partnership transforms cleaning from a reactive step into a proven, optimized process.


Conclusion: cleaning is process control, not cleanup


In PCBA rework, cleaning is one of the most powerful reliability tools available. It bridges the gap between a repaired assembly and a truly restored assembly.


The key is understanding that effective cleaning depends on: ● Choosing chemistry that matches the contamination


● Ensuring full compatibility with board materials and components


● Treating cleaning as an engineered, validated process


As electronics continue to evolve toward smaller geometries and higher reliability requirements, rework cleaning will only become more essential.


Matching the cleaner to the contamination, while protecting the materials that make up the assembly, is the foundation of successful, high-quality PCBA rework.


www.microcare.com Components in Electronics March 2026 29


Page 1  |  Page 2  |  Page 3  |  Page 4  |  Page 5  |  Page 6  |  Page 7  |  Page 8  |  Page 9  |  Page 10  |  Page 11  |  Page 12  |  Page 13  |  Page 14  |  Page 15  |  Page 16  |  Page 17  |  Page 18  |  Page 19  |  Page 20  |  Page 21  |  Page 22  |  Page 23  |  Page 24  |  Page 25  |  Page 26  |  Page 27  |  Page 28  |  Page 29  |  Page 30  |  Page 31  |  Page 32  |  Page 33  |  Page 34  |  Page 35  |  Page 36  |  Page 37  |  Page 38  |  Page 39  |  Page 40  |  Page 41  |  Page 42  |  Page 43  |  Page 44