Supplement: Interconnection


Considerations for connectors in embedded and industrial systems


Industrial and embedded systems are developed under exceptionally strict cost pressures but are now also forced to operate under far tighter tolerances and in harsher conditions than would have previously been the case. Additional factors, notably the space they are afforded, and the implementation of industrial internet of things (IIoT) - and with it, increased data volumes - mean that connector integrity and durability have become critical.


This rapid evolution has meant it is vital to consider how the operation will change during a system’s life and here Harwin’s John Feaster, product manager of BBi Connectors, examines five key trends - and the considerations needed for future-proofing applications against them…especially when budgets are tight.


1) More vibration is encountered Today’s monitoring and automation systems are often exposed to greater levels than would previously have been the case. Connectors must be able to maintain reliability under these conditions and vibration resistance is no longer a luxury that can be overlooked.


The techniques developed for the creation of high-reliability (HRI) connectors for use in extreme environments – such as Harwin’s Datamate – are slowly filtering down to connector ranges targeted at industrial and embedded systems.


A good example of this can be seen in Harwin’s Kontrol range of connectors, which is designed for high vibrational stress, with components tested to withstand 20G for 12 hours. Features like shrouded pins and secure latching mechanisms should also be considered to help maintain a secure connection vibration.


2) More mating cycles are needed Keeping on the theme of durability, recent years have seen a significant increase in the number of mating cycles that connectors now need to undergo. Like for vibration resistance, techniques developed by the more advanced connector suppliers for HRI ranges are making their way into lower-priced BBi connector ranges. Again, using Harwin’s Kontrol range of BBi connectors as an example, these are rated to 500 mating cycles, which is very high for an industrial component. Still, designers should calculate the likely number of matings that will be required during the system’s lifetime to understand if a standard commodity connector is suitable, or if a dedicated HRI model is needed.


28 February 2025 Fig 1: Harwin’s single-row range of Kontrol implement features such as a latched design and are positively polarized to assist blind mating


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Modern systems are required to pack ever-more functionality into smaller spaces. As some of the bulkier components on the board, connectors play a key role in enabling this miniaturisation. Smaller, lower profile connectors have been created even in BBi ranges for lower-cost applications and the trend for miniaturisation is also being applied to the pitch and pin configurations, with more pins in smaller connectors that use better layouts.


However, the use of smaller connectors is not the only way to achieve smaller PCB


Components in Electronics


and designers should consider the overall system. How essential is each pin? Can it be eliminated?


Another way to shrink the design at the system level is through mixed layout and hybrid connectors that combine power and signal options on a single unit.


4) More EMI is encountered As equipment becomes more complex and tighter packed, the risk of electromagnetic interference (EMI) affecting unprotected systems also increases.


To futureproof, the lifetime operating environment of a system (and a noisy


EMI environment) therefore needs to be considered, with steps taken to minimise not only the existing but future EMI levels they will encounter.


Designers therefore need to think about the layout and if it permits a standard board-to- board connector, such as Kontrol, or if the use of EMI-mitigation hardware – such as the use of backshells and braided cable assemblies – are warranted.


5) Manufacturing tolerances are 


The downside to miniaturisation, with boards using multiple small-pitch connectors, is


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