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Blaize™ emerges from stealth to transform AI computing
Blaize, formerly known as Thinci, unveils the first true Graph- Native silicon architecture and software platform built to process neural networks and enable AI applications with unprecedented efficiency
• Blaize Graph Streaming Processor™ (GSP) architecture: the first to enable concurrent execution of multiple neural networks and entire workflows on a single system, while supporting a diverse range of heterogeneous compute intensive workloads
• Fully programmable solution brings new levels of flexibility for evolving AI models, workflows, and applications that run efficiently where needed, a breakthrough for dynamic intelligence at the edge
• Directly addresses technology and economic barriers to AI adoption via streamlined processing that yields 10-100x improvement in systems efficiency, lower latency, lower energy, and reduced size and cost
• Early access customer engagements since 2018 in automotive, smart vision and enterprise computing segments
Blaize today emerged from stealth and unveiled a groundbreaking next-generation computing architecture that precisely meets the demands and complexity of new computational workloads found in artificial intelligence (AI) applications. Driven by advances in energy efficiency, flexibility, and usability, Blaize products enable a range of existing and new AI use cases in the automotive, smart vision, and enterprise computing segments, where the company is engaged with early access customers. These AI systems markets are projected to grow rapidly* as the disrupting influence of AI transforms entire industries and AI functionality becomes a “must-have” requirement for new products.
“Blaize was founded on a vision of a better way to compute the workloads of the future by rethinking the fundamental software and processor architecture,” says Dinakar Munagala, Co-founder and CEO, Blaize. “We see demand from customers across markets for new computing solutions that address the immediate unmet needs for technology built for the emerging age of AI, and solutions that overcome the limitations of power, complexity and cost of legacy computing.”
Ultra-compact 200W desktop power supply
from FiDUS features Gallium Nitride switching 2.5x smaller than comparable products
FiDUS Power, the technical power supply distributor specializing in innovative solutions and new products that benefit system designers as they seek to differentiate their end products, sets a new bar for the size of external power supplies with the launch of the new model GDA200. The use of Gallium Nitride (GaN) rather than silicon semi-conductor switches provides increased efficiency, reduced heat losses and operation a higher-frequencies, allowing the size of magnetics and other components to be reduced. The result is an amazingly-compact 200W external desktop power supply with market leading 12.5W/In³ power density.
The FiDUS GDA200 will be welcomed by system designers looking for a sleek power supply to accompany and enhance innovative new products that deliver an image of quality and leading edge technology. It will be advantageous to designers of portable equipment and instrumentation in markets including; high end audio, test and measurement, bench top and audio broadcast equipment.
The ultra-compact size is also advantageous to customers incorporating external power supplies into their designs to speed up the approvals process. The very small size, just 150 x 54 x 33mm (5.9 x 2.12 x 1.3”) may also reduce total system package size resulting in higher shipping and storage densities, especially when the closest competitive product is some 2½ times larger.
www.fiduspower.com
OMC’s FDH1M SMA fibre optic housing wins Elektra Award 2019 for Excellence in Product Design, High Reliability Systems
Enables consistent, reliable, extended-lifetime datalinks in contaminated environments; secure and tamper-proof
OMC, the pioneer in optoelectronics design & manufacture, has won the coveted Elektra Award 2019 for Excellence in Product Design, High Reliability Systems. The Cornwall, UK-based company has an enviable reputation for producing high- quality, innovative fibre-optic systems and providing solutions for challenging applications in industries ranging from aerospace through to medical. Its FDH1M SMA fibre optic housing was specifically designed for datalink applications in environments with airborne contaminants.
Datalinks are among the most challenging types of fibre optic system to specify, design and manufacture consistently. Commodity fibre optic components designed for consumer-grade applications rarely meet the performance, robustness and consistency requirements needed for industrial use. The FDH1M SMA housing with Fine Particulate Ingress Shield prevents even fine airborne particulates entering the face of optical fibres, which is a common cause of failure in optical datalinks when used in contaminated environments. OMC’s fibre optic systems can achieve 100% yield at the point of installation and throughout a product life extending over 25 or more years, with no failures in the field.
New Lattice CrossLink-NX FPGAs bring Power and performance leadership to Embedded Vision and
Edge AI applications • First Product on New Lattice Nexus FPGA Platform
• Up to 75% Lower Power Compared to Similar Class Competitive Devices
Lattice Semiconductor Corporation (NASDAQ: LSCC), the low power programmable leader, today announced the first FPGA developed on its new Lattice Nexus™ FPGA platform, CrossLink-NX™. This new FPGA provides the low power, small form factor, reliability, and performance that developers need to create innovative embedded vision and AI solutions for communications, compute, industrial, automotive, and consumer systems.
According to Patrick Moorhead, president and founder of Moor Insights & Strategy, “Technology trends like 5G connectivity, cloud-based analytics, factory automation and the smart home are driving demand for embedded vision solutions that support machine learning. However, the data latency, cost and privacy issues associated with cloud-based ML analytics have sparked interest among developers in moving more data processing from the cloud to the Edge. But doing so requires OEMs have access to Edge AI/ML inferencing solutions that offer high performance data processing, low power operation, and a small form factor.”
FPGAs are a compelling hardware platform for embedded vision and AI applications, as they perform functions in parallel. This parallel architecture significantly accelerates certain processing workloads, including data inferencing.
www.latticesemi.com Rugged, modular MIL 83513 1.27mm pitch connector
with captive fixings suits thick PCBs and AWG24 cable Nicomatic’s easy-to-use EMM series suits harsh-environment defense applications
Nicomatic SA, the leading manufacturer of high- performance interconnect systems, has announced new features for its rugged micro connector, the 1.27 mm pitch EMM series, which targets defense and other high-reliability applications. The MIL 83513- style connectors that require a significantly smaller footprint than the closest industry competitor now feature captive screw fixings and can be used with thicker PCBs and larger diameter cables.
Captive screw fixings provide the fastest locking solution available, since there is no need to tighten alternative sides repeatedly. They also ensure that
screws are never lost. EMM miniature connectors are also now optionally available with longer straight- through and 90° contacts enabling them to be used on PCBs that are up to 3.5mm thick. Finally, EMM connectors can also be used with AWG24 cable, larger than competing devices.
Suited for both board-to-board and board-to-wire (from awg 24 to 30) applications, EMM connectors are available with any pin selection from 04 to 60 signal contacts. Signal contacts are rated for up to 3A, and deliver a wiping length of 1.27mm with 1.27µm gold plating to ensure that signal integrity is maintained while under conditions of heavy shock and vibration. Devices are rated for up to 45 G vibration, exceeding EIA 364-28E test conditions III&IV, up to 160 G for shock, exceeding EIA 364-27B G, and for an operational temperature range of -65 to +260°C exceeding EIA 364-32D.
Innovative design features such as reversed contacts, integrated 90° back protection and interchangeable hardware, ensures that the new EMM connector series combines rugged design with enhanced electrical and environmental performance.
www.nicomatic.com
Pickering Electronics to present ‘Technical Considerations when Designing with Reed Relays’ paper at Relay Forum
Pickering Electronics, the reed relay company which has pioneered miniaturisation and high performance for over 50 years, presented a paper entitled ‘Technical Considerations when Designing with Reed Relays’ at the User Forum for Relay Technology in October 2019. The presentation took design engineers ‘beyond the datasheet’ and described in detail some of the key design and manufacturing aspects that determine and differentiate the operational performance of reed relays. Pickering’s aim is to increase designers' understanding of functional details of reed relays beyond the bare facts presented on datasheets, enabling better end product design.
Accepting the trophy at the prestigious Elektra Award ceremony held in London’s Grosvenor Hotel, OMC’s Commercial Director, William Heath said: “We are thrilled to have received this Elektra Award for Excellence in Product Design for High Reliability Systems. We invest heavily in R & D, together with the latest manufacturing equipment and techniques, in our purpose-built factory, where we developed the FDH1M housing with Fine Particulate Ingress Shield to ensure that datalinks carrying vital information in many critical applications can function reliably and consistently over an extended lifespan.”
www.ome-uk.com
James Jose, OMC (left) and William Heath, (right) OMC with the Elektra Award 2019 for Excellence in Product Design, High Reliability Systems
The Relay Engineering User Forum is a platform for industry experts to discuss and present fundamentals and practical knowledge on relay applications, technical options of specific relays and current developments. Best practice examples highlight the implementation of switching applications in machines, devices, systems and process control. The focus of the event is on practical relevance and to enable direct implementation of the content by the participants.
Delegates at the forum are engineers, design engineers, technicians and industrial engineers from development, application technology, quality assurance, purchasing and component approval for users and manufacturers of electrical switchgear and electronic control systems. The event will be accompanied by a table-top exhibition.
Commented Keith Moore, CEO, Pickering Electronics: “The User Forum for Relay Technology is a great opportunity for manufacturers of reed relays to share their expertise and discover new product opportunities. Delegates will also benefit from a better understanding of how to get the most out of all types of relays to maximise functionality and reliability.”
www.pickeringrelay.com
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