Digital & Communication
Combat Proven Technologies launches Datalinks M2DLS
C
Teeny, tiny SoC D
ialog Semiconductor has announced both the new DA14531, the world’s smallest and most power-efficient Bluetooth 5.1 SoC, and the DA14531 module, to simplify Bluetooth product development and enable wider adoption. The chip, also known as SmartBond TINY,
is currently in production. SmartBond TINY is specifically designed to lower the costs of adding BLE functionality to an application to as little as $0.50 in high volumes, fueling the next wave of the IoT, estimated to span over one billion devices. As the list of devices requiring wireless connectivity continues to grow, the cost of enabling a complete IoT system is under pressure. SmartBond TINY addresses the growing breadth and costs of IoT devices by enabling a complete system cost reduction through a smaller footprint and size, while maintaining performance quality at a level unmatched by its competitors. The DA14531 makes it possible to extend wireless connectivity to applications where it would have previously been prohibitive in terms of size, power or cost, especially those within the growing connected medical field. SmartBond TINY will help facilitate connectivity for inhalers, medicine dispensers, weight scales, thermometers, glucose meters and more. At half the size of its predecessors, SmartBond TINY is available in packages as small as 2.0 x 1.7 mm. Moreover, the SoC’s high level of integration only requires six external passives, a single clock source and a power supply to make a complete Bluetooth low energy system. For developers, this means SmartBond TINY can easily fit into any design, such as electronic styluses, shelf labels, beacons or active RFID tags for asset tracking. It will also be critical for applications that require provisioning such as cameras, printers and wireless routers. Consumers will also reap the benefits of SmartBond TINY’s reduced system size and power, in remote controls as a replacement for infrared (IR) or for other applications such as toys, keyboards or smart credit and banking cards. SmartBond TINY is based on a powerful 32-bit Arm Cortex M0+ with integrated memories and a complete set of analog and digital peripherals, delivering a record score of 18300 on the latest IoTMark-BLE, the
34 December/January 2020
EEMBC benchmark for IoT connectivity. Its architecture and resources allow it to be used as a standalone wireless microcontroller or as an RF data pipe extension for designs with existing microcontrollers.
The SmartBond TINY module, leveraging the capabilities of the main DA14531 chip, makes it easy for customers to leverage the new SoC as a part of their product development, instead of having to certify their platforms themselves, thereby saving time, development efforts and costs. The module is also designed to balance running a high number of applications while keeping cost additions to the overall system as low as possible. Breaking through the $1 target for a BLE module lowers the threshold for adding SmartBond TINY to a system and driving a multitude of applications, helping fuel a new generation of IoT-enabled devices.
SmartBond TINY and the module use just half of the energy of their predecessors, the DA14580 and DA14580-based module, as well as all other offerings currently on the market. TINY’s record-low power consumption ensures a long operating and shelf life, even with the smallest of batteries. The DA14531’s integrated DC-DC converter enables a wide operating voltage (1.1 to 3.3V) and can derive power directly from environmentally-friendly, disposable silver oxide, zinc air or printable batteries required for high-volume applications, such as connected injectors, glucose monitors and smart patches.
“The addition of SmartBond TINY and the module builds upon Dialog’s leading presence in the Bluetooth market. With the ability to turn any device, even disposable ones, into a connected application, the TINY SoC and module are opening new markets and driving the adoption of BLE beyond what was previously thought possible in today’s landscape,” says Sean McGrath, SVP, Connectivity and Audio Business Group of Dialog Semiconductor. “TINY and its module’s small size and power footprint, combined with Bluetooth 5.1 compliance, pave the way for the next one billion IoT devices.”
dialog-semiconductor.com Components in Electronics
ombat Proven Technologies (CP Tech) launched the Mini Micro Data Link System (M2DLS) at the 2019 MILCOM conference.
The M2DLS is an advanced single unit digital data link system specifically designed for micro and small size platforms which are sensitive to Size, Weight and Power (SWaP). As effective solution for most requirements known today, this advanced system uses open architecture and enables full duplex wideband, digital link, error correction techniques and high-rate communication in the Uplink (UPL) and Downlink (DNL) channels. The M2DLS can downlink real-time video images, LAN, serial data and information from most available sensors. It combines proven
technologies and standards with advanced algorithms, to provide reliability and high performance, for the harshest conditions. The M2DLS provides full duplex digital communication. This makes it ideal for applications such as usage in drones and loitering munitions. Using open architecture and in-house development, CP Tech enables full duplex wideband, digital link, error correction and high-rate communication for uplink and downlink channels. It combines proven technologies and standards with advanced algorithms to provide reliability and high performance for the harshest conditions.
cp-techusa.com
AKR selects Rambus SerDes and Security IP for aerospace and satellite communications
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ambus Inc announced that SEAKR Engineering, a provider of advanced electronics for space applications, selected the Rambus 28G Multi-protocol LR SerDes PHY and the CryptoManager Root of Trust for its next-generation ASIC and FPGA designs. “We’re delighted that SEAKR has chosen Rambus high-speed interface and defense-grade security cores to provide their customers innovative and silicon-proven technologies,” says Sean Fan, chief operating officer at Rambus. “Leading-edge IP solutions are mission critical to addressing the system design challenges for aerospace and satellite communications. Rambus best-in-class power, performance and area (PPA), including versatile and multi-protocol SerDes solutions and silicon-proven architecture were key differentiators in SEAKR’s decision.” Today’s aerospace hardware contains highly-complex microelectronics that include advanced processing, data storage, and data communications capabilities. It is important to deliver both the performance needed by aerospace hardware and the means to ensure the data processed, stored and communicated remains secure. Our industry-leading interface and security IP solutions make possible faster, more secure, mission-critical electronic systems.
The Rambus portfolio of silicon IP
provides a one-stop-shop for high- speed interface and security IP. The 28G Multi-protocol LR SerDes PHY is designed with a system-oriented approach, taking the interface, interconnect and channel into account to optimise performance and maximise flexibility for today’s most challenging system environments. The CryptoManager Root of Trust is a family of fully- programmable secure co-processors that provides a foundation for system security anchored in hardware and protect against a wide range of attacks with state-of-the-art anti-tamper and security techniques. “Rambus’ ability to provide IP solutions for both moving and securing data with state-of-the-art performance was a key benefit in the selection process,” says Tony Lowry, ASIC program manager at SEAKR. “We are delighted to partner with Rambus as a valued silicon IP provider for both high-speed interfaces and embedded security, enabling SEAKR to support the advanced performance and data security needs for our aerospace customers, bringing these complex systems to market more quickly.”
rambus.com/cryptomanager
www.cieonline.co.uk
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