ADVERTORIAL TECHNOLOGY IN ACTION


New 0.5Amp Large PXI Matrix Modules from Pickering Interfaces have up to 6,144 Crosspoints


BlaizeEmerges from Stealth to Transform AI Computing


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laize, formerly known as Thinci, unveils the first true Graph-Native silicon architecture and software platform


built to process neural networks and enable AI applications with unprecedented efficiency


Blaizetoday emerged from stealth and unveiled a groundbreaking next-generation computing architecture that precisely meets the demands and complexity of new computational workloads found in artificial intelligence (AI) applications. Driven by advances in energy efficiency, flexibility, and usability, Blaize products enable a range of existing and new AI use cases in the automotive, smart vision, and enterprise computing segments, where the company is engaged with early access customers. These AI systems markets are projected to grow rapidly* as the disrupting influence of AI transforms entire industries and AI functionality becomes a “must-have” requirement for new products.


Blaize  +1 916 347-0050  Blaize.com


0.5Amp ultra-high-density PXI matrix module family that delivers up to 6,144 crosspoints. With a switching density 39% higher than competing devices, the 40-558 allows a complete functional ATE system to be housed in a single 3U PXI chassis, and the integrated BRIC design saves on valuable chassis slots compared to standard PXI matrix modules. Part of Pickering Interfaces’ BRIC large PXI Matrices range, the new 40-558 modules are available in two, four or eight-slot widths for matrix sizes between 64x16 and 1,008x6. The modules are fitted with high quality, ruthenium-sputtered reed relays – manufactured by sister company, Pickering Electronics – which feature a very long life with good low-level switching performance and excellent contact resistance stability. Automatic isolation relay switching maximizes bandwidth and reliability. Spare relays are included with the module to facilitate easy maintenance with minimum downtime.


P Pickering Interfaces  01255 687900  www.pickeringtest.com


New beam angle LEDs from OMC focus light precisely for demanding high-intensity applications


beam LED and a 60 degree beam LED. Both new LEDs are produced by OMC in a range of package styles, beam angles and all popular LED wavelengths, plus infra-red versions. The two new devices join the SMD emitter series launched by OMC in late 2018, which includes a 30 degree output beam device that has proved very popular. The two new SMT LEDs provide designers with even greater choice and flexibility for a very wide range of applications, including signalling, indication, sensing and communications


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applications. The new narrow 15 degree angle and the 60 degree angle SMT LEDs open up design possibilities for engineers needing to provide a clear human-machine interface and ensure precision and accuracy. They are especially targeted at high-intensity applications where the beam needs to be seen from a distance, such as signalling, indication, sensing and communication.


OMC


Rugged, modular MIL 83513 1.27mm pitch connector with captive fixings suits thick PCBs and AWG24 cable


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icomatic SA, the leading manufacturer of high-performance interconnect systems, has announced new features for its


rugged micro connector, the 1.27 mm pitch EMM series, which targets defense and other high-reliability applications. The MIL 83513-style connectors that require a significantly smaller footprint than the closest industry competitor now feature captive screw fixings and can be used with thicker PCBs and larger diameter cables. Captive screw fixings provide the fastest locking solution available, since there is no need to tighten alternative sides


repeatedly. They also ensure that screws are never lost. EMM miniature connectors are also now optionally available with longer straight-through and 90° contacts enabling them to be used on PCBs that are up to 3.5mm thick. Finally, EMM connectors can also be used with AWG24 cable, larger than competing devices.


Nicomatic  00 33 (0)4.50.36.13.85  www.nicomatic.com


Mouser Electronics Signs Global Agreement with SEARAN to Offer Bluetooth SDKs for Multiple OS


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ouser Electronics, Inc., has announced a global distribution agreement with SEARAN, a fast-growing provider of Bluetooth® wireless


connectivity, with tens of millions of licenses sold for innovative solutions in consumer, medical, and industrial applications. The SEARAN product line, now available from Mouser Electronics, provides developers with the company’s royalty-free software development kits (SDKs), which support devices from leading semiconductor manufacturers, including STMicroelectronics, Texas Instruments, Microchip Technology, Marvell Semiconductor, and Renesas Electronics. SEARAN’s wireless audio player software (Linux or FreeRTOS) and wireless speaker software (FreeRTOS) provide applications that enable wireless audio streaming from an audio player to a headset or a speaker via Advanced Audio Distribution Profile (A2DP) and Audio/Video Remote Control Profile (AVRCP) Bluetooth profiles. SEARAN wireless headset software provides an application for either Linux- or FreeRTOS-based platforms that enables audio streaming and phone calls from a smartphone to a headset via Hands Free Profile (HFP), A2DP, and AVRCP Bluetooth profiles.


Mouser Electronics 40 NOVEMBER 2019 | ELECTRONICS  (817) 804-3833  www.mouser.com Lattice’s CrossLinkPlus FPGAs


Accelerate Video Bridging for World- class Embedded Vision Systems


embedded vision systems. CrossLinkPlus devices are innovative, low power FPGAs featuring integrated flash memory, a hardened MIPI D-PHY and high-speed I/Os for instant-on panel display performance, and flexible on- device programming capabilities. Additionally, Lattice provides ready-to-use IPs and reference designs to accelerate implementation of enhanced sensor and display bridging, aggregation, and splitting functionality, a common requirement for industrial, automotive, computing, and consumer applications. Developers want to enhance the user experience by adding multiple image sensors and/or displays to embedded vision systems, while also meeting system cost and power budgets. Lattice addresses this need with CrossLinkPlus FPGAs: small (3.5 x 3.5 mm), low power (< 300 µW) devices specifically optimized for embedded vision applications with features like a hardened MIPI D-PHY, broad high-speed I/O support for interfaces like OpenLDI and RGB, and on-chip non- volatile flash memory.


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Lattice Semiconductor  408-826-6339  www.latticesemi.com


CONNECTINGINDUSTRY.COM/ELECTRONICS


attice Semiconductor today introduced the CrossLinkPlus™ FPGA family for MIPI D-PHY based


 01209 215424  www.omc-uk.com


MC, the pioneer in optoelectronics design & manufacture, has introduced two new surface-mount LEDs, an ultra-narrow 15 degree


ickering Interfaces, a leading provider of modular signal switching and simulation for electronic test and verification, has launched a new


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