ADVANCED NETWORKING SYSTEM WITH WIRELESS BATTERY MANAGEMENT SYSTEM IN BMW I3 O
ne of the first wireless automotive battery
management system (BMS) concept cars has been unveiled by Linear Technology Corporation. This was developed by Linear’s design partner LION Smart, with a mix of battery
stack monitors from Linear with its SmartMesh wireless mesh networking products in a BMW i3, taking out the need for traditional wired connections between the battery packs and the battery management system. What this technology shows is
that it is possible for a fully wireless BMS car that is ultimately reliable, available at a lower cost and weight, and can reduce the wiring complexity for large multicell
battery stacks for electric and hybrid/electric vehicles. The current concerns for car
manufacturers are to ensure that electric and hybrid/electric vehicles are both safe and reliable. Linear’s high voltage battery stack monitors are designed to enable battery management systems that maximise battery pack performance and longevity. The company’s LTC6811 can measure up to 12 series- connected battery cell voltages with
more than 0.04% accuracy. Combining the LTC6811 with
Linear’s SmartMesh wireless mesh networking system addresses the persistent reliability issues associated with automotive wiring harnesses and connectors. Wireless connectivity enables
more flexible placement of battery modules, and enables installation of sensors in locations previously unsuitable for a wiring harness.
www.linear.com
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HIGH-LEVEL SECURITY SYSTEM FOR IN-CAR ELECTRONIC CONTROL UNITS
Renesas Electronics and Escrypt are collaborating on an integrated hardware and software platform solution that will provide high-level security for protecting automotive electronic control units (ECUs). The new joint hardware/software
platform solution combines Renesas' RH850/P1x-C Series of automotive safety microcontrollers (MCUs) that combine on a single-chip: functional safety, security, and vehicle control network technologies, with Escrypt’s CycurHSM, a security software stack, for highly complex automotive security solutions.
The solution is described as a stepping
stone to achieving autonomous driving by accelerating the integration of safety and security functions. In the autonomous-driving era, in-
vehicle infotainment, vehicle-to-vehicle (V2V), and vehicle-to-infrastructure (V2I) networks are expected to become mainstream. The connectivity between these networks allows systems to obtain information on road conditions and other factors that could impact the driving experience. It also requires robust security measures to ensure the systems are
protected from unauthorised external access. This latest series of devices integrates
a hardware security module with a co- processor, supporting data encryption, authentication and random number generation to address these mission- critical security requirements in vehicle systems. CycurHSM is a security software stack that is well suited to RH850/P1x-C MCUs and complements the security features in hardware with additional security services, e.g., secure boot, secure flashing, and debugging.
www.renesas.com
Astute Electronics has agreed a Reseller-Supply deal with Alliance Memory Inc, a fabless manufacturer of legacy memory products. The agreement is one of the first that the company has announced for its new memory division, which is headed up by industry veteran, Mick Martin. Alliance Memory produces ICs that are pin-for-pin drop-in replacements for SRAM and DRAM parts from Micron, Samsung, ISSI, Cypress, Nanya, Hynix and others.
www.astute.co.uk PRINTED ELECTRONICS D
isplay technology and the user interface is really
evolving the way we integrate with electronics, with touch technology receiving considerable focus as explored on p8. Building occupancy detection goes under the spotlight in our cover story special on p12, focusing on the latest PIR sensors. Processing power and the advanced capabilities of the latest feature-rich and flexible family of next-generation I/O controllers features on p16. Where to place trust in security is the focus of our embedded technology feature on p18 plus a spotlight on the latest new product releases. Michelle Winny Editor
4 NOVEMBER 2016 | ELECTRONICS
percent since 2010. According to the consulting firm Smithers Apex, the market volume is predicted to grow to an estimated 43 billion US dollars by 2020 so, against this backdrop of industry growth, the signs are good for Lopec 2017. This exciting technology is already
Lopec, an international event for the printed electronics industry, will take place in Munich, Germany, at the end of March 2017. The two day exhibition taking place March 29–30th and three day conference March 28–30th will provide attendees and delegates with a great opportunity to keep right up to date with all the latest developments in this increasingly important and rapidly growing technology sector. The global revenue for products using
printed and organic electronics during 2016 is estimated to be 26.9 billion US dollars, an annual increase of 31.8
being used in applications across a large number of industries. In the medical sector, these include interactive devices and pharmaceutical packaging while in automotive, OLED tail lights and in consumer electronics, displays and sensors. “Interest in printed and organic
electronics continues to rise, as does the demand for products and solutions that leverage these technologies,” said Dr Peter Fischer, Chief Operating Officer at Thin Film Electronics ASA. “Platforms such as LOPEC play a
vital role in supporting innovation and fuelling business success. Thinfilm will be exhibiting again in 2017 and we look forward to strengthening existing relationships and uncovering new opportunities”, he added.
www.lopec.com
A Modular IoT Gateway Solution for large node networks has been unveiled by NXP Semiconductors with pre- integrated, tested and RF certified support for wireless communications protocols including Thread, ZigBee and Wi-Fi. This helps building out of gateways using a choice of wireless protocols for end-to-end wireless communications in LNN configurations with supporting cloud options such as Amazon Web Services (AWS). Operators of smart commercial buildings and smart industrial environments deploying massive mesh networks need to be able to commission, control and monitor thousands of end nodes. Built on an open source Linux platform running on the latest
i.MX processors, the Modular IoT Gateway connects Thread and ZigBee-based end node devices securely with the cloud through Wi-Fi or Ethernet. In addition, local intelligence enables time critical responses and operation even when cloud connectivity is not available.
www.nxp.com
Congatec has announced its first credit card sized modules for the new SMARC 2.0 specification. They are based on the new 14nm Intel Atom, Celeron and Pentium processors (Apollo Lake). The new conga-SA5 devices offer low-power processing, and pre-integrated on board wireless interfaces for IoT.
www.congatec.com / ELECTRONICS
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