SUPPLEMENT INTERCONNECTION BRAND UNIFICATION CREATES “SMITHS INTERCONNECT” S


miths Interconnect,


a division of Smiths Group plc, has announced it is unifying its technology


brands of EMC Technology, Hypertac, IDI, Lorch, Millitech, RF Labs, Sabritec, TECOM, and TRAK under the single brand identity of ‘Smiths Interconnect’. The company advises, this brand transition supports a recent


strategic reorganisation focused on creating a more agile structure that can better anticipate and respond to customers’ evolving needs. Individually, the technology brands


represent state-of-the-art solutions across the connectors, microwave components and microwave subsystems markets. Providing a strong umbrella brand that supports the breadth of these products and technologies will make Smiths Interconnect a more comprehensive solutions provider, improving the customer experience by streamlining


access and interactions across multiple applications. “Over time, interactions among


our brands have increased across many of our markets,” said Roland Carter, President of Smiths Interconnect (pictured). “Aligning all this activity under the Smiths Interconnect name will make us a more streamlined partner, enhancing our customers’ access to the combined strength of our products, expertise and application knowledge.” www.SmithsInterconnect.com


SURFACE MOUNT CONNECTOR


Harting has introduced surface-mount versions of its M12 miniature circular connectors that are compatible with rapid assembly processes using automated pick & place systems. The automated assembly of printed circuit boards is expanding to include ever more components. This new connector, keeps up with this trend,


BIPASS CABLE ASSEMBLIES OFFER HIGH-SPEED AND HIGH-DENSITY


Molex is rolling out its new BiPass I/O and Backplane Cable Assemblies, combining QSFP+, Impel or near-ASIC (Application Specific Integrated Circuit) connectors with thin twinax cables. The company advises, the BiPass I/O and Backplane Assemblies provide a low-insertion-loss alternative to PCB traces capable of meeting 112Gbps PAM-4 (pulse-amplitude modulation) protocol. To meet today’s demanding industry requirements,


datacentre and other customers designing TOR switches, routers and servers need high performance I/O and backplane connections. They must be capable of high bandwidth speeds and efficiency, while ensuring proper


thermal management in densely packed circuits without sacrificing signal integrity. BiPass Assemblies provide terminated I/O ports that connect via twinax cables to high density, high performance near-ASIC connectors in order to maintain the highest level of signal integrity from ASICs to the I/O. BiPass Assemblies also use near- ASIC connectors with low stack height for a smaller footprint within trays and panels to overcome inherent space constraints. “BiPass Assemblies offer our customers a complete solution to enable 56Gbps and 112Gbps PAM-4


implementation by significantly reducing signal to noise ratios from the ASIC to I/O,” said Brent Hatfield, new product development manager, Molex. “The integrated, one-piece design using board-mount connectors also ensures easy installation for contract manufacturers.” BiPass I/O and Backplane Cable Assemblies are ideal for applications in several markets, including data


communications as well as telecom and networking. Assemblies are thoroughly tested, eliminating the need for customers to conduct their own tests. They can be easily customised to individual front panel configurations, according to the needs of specific applications. www.molex.com


which will be available in codes A, D and X in male and female versions. This move will bring both power and Ethernet at up to 10Gbit/s to the PCB via new miniaturised switches. The benefits of this approach are the


automated, rapid and more cost-effective placement of the connection, since dispensing with through-hole contacts means that the board can now be populated on both sides. The result is a miniaturised solution that is faster and less expensive to produce. www.harting.co.uk


RS Components is adding more than 190 additional devices, including RF and coaxial connectors to it Samtec range, for use in wireless telecommunications applications. Key product types being introduced include: the high-speed and high-density Razor Beam self-mating systems, which helps reduce inventory costs and are available in a variety of pitches and lead styles for increased flexibility; high-density micro connector systems; and a range of RF connector products including PCB Headers, MMCX connectors and coaxial cable assemblies. www.rs-online.com


ETHERNET CRIMP CABLE CONNECTORS FOR HARSH RAIL APPLICATIONS 3600


EMI/RFI shielding in one of the smallest


form factors on the market, ideal for restricted assembly conditions. In addition to extreme vibration resistance, the housing design is waterproof to IP-67 when screw locked. This connector series has a completely


The new Provertha M12 X-Code 10Gbit Ethernet Crimp connector is now available at Aerco. It is designed to deliver fail-safe connection and secure data transmission of up to 10Gbits for Cat6a Ethernet in railway and other mass-transit applications. This connector is claimed, achieves


S4 MARCH 2017 | ELECTRONICS


shielded full metal housing, reducing crosstalk and signal coupling. Turned and gold-plated crimp contacts maintain secure contact termination of Ethernet signal wires even under extremely harsh high vibration conditions, delivering robust and reliable high-speed data transmission rates to TIA-568 and ISO/IEC-11801 Cat6A specifications. Using the new X-coded connectors, complete high-speed data


transmission systems delivering 10Gbits can be built in the M-12 format. When compared to D-coded M12 connectors,


this is approximately one hundred times faster. The design of these connectors also features a special crimp sleeve/crimp flange system for reliable torsion proof strain relief. The connector cannot be disassembled (tampered with) once terminated. Technical specifications for these connectors


include shock and vibration qualification to DIN EN 61373 Category 1, Class B. Available in AWG sizes 22-26, they are qualified for up to 250 mating cycles. www.aerco.co.uk


/ ELECTRONICS

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