PRODUCTS POWER ELECTRONICS


NEW EVALUATION BOARD FOR THREE-PHASE BLDC MOTOR DRIVE ICS The devices are housed in a


as coolers for fresh goods in supermarkets and other applications. The family of three BLDC driver


A


new evaluation board has been developed by Toshiba


Electronics Europe for its TPD420xF series of brushless DC (BLDC) three-phase motor driver ICs. The board helps to speed up the process of prototyping and developing new motor drive solutions up to 80W including white goods, home devices such as hair dryers as well


ICs use high voltage PWM control and are fabricated with a high voltage (500V/600V) process. They are highly integrated and contain a level-shifting high-side driver, low-side driver, MOSFET outputs, voltage regulator and multiple circuit protections including overcurrent, undervoltage and thermal protection. A three-shunt resistor circuit is


also included for three-phase current sensing. The TPD4204F and TPD4206F are rated at 2.5A while the TPD4207F is capable of delivering 5A of output current.


small SSOP30 package measuring just 20mm x 14.2mm x 2.2mm and accept logic-level inputs from a microcontroller or motor controller to drive the BLDC motor. The evaluation board measures


100mm x 100mm and contains all of the required passive components required to create a BLDC motor driver. Multiple pads are provided to connect and configure the external driver and motor. Probing pads are also provided to


facilitate easy monitoring of key voltage waveforms, thereby allowing designers to accurately monitor performance of development projects.


http://toshiba.semicon-storage.com


MOSFETS OFFER LOW RDS


(ON) FOR AUTOMOTIVE


Nexperia has released its lowest RDS(on) MOSFETs. The AEC-Q101 Trench 9, 40V


automotive superjunction MOSFETs in a rugged, electrically- and thermally- efficient LFPAK56E are claimed to deliver a footprint reduction of up to 81% when compared to traditional solutions such as bare die modules, D2PAK or D2PAK-7 devices. The 0.9mΩ, 220A DC-rated BUK9J0R9- 40H MOSFET suits applications up to 1.2kW, and is also lower cost than larger D2PAK devices which were the previous best solution. As well as reducing RDS(on)


the new QUICK CHARGING VIA STANDARD USB CABLE AND GENERIC MOBILE CHARGER


Exagan, founded in 2014 with support from CEA-Leti and Soitec claims it is accelerating the transition to greater power efficiency by launching its safe, powerful G-FET power transistors and G-DRIVE intelligent fast-switching solution featuring an integrated driver and transistor in a single package. These GaN-based devices are said to be easy to design into electronic products, paving the way for fast chargers that comply with the USB power delivery (PD) 3.0 type C standard while providing so called “exceptional” power performance and integration. “The market potential for our products is enormous including all portable electronic devices as well as


homes, restaurants, hotels, airports, automobiles and more,” said Frédéric Dupont, president and CEO of Exagan. “In the near future, users will be able to quickly charge their smart phones, tablets, laptops and other devices simply by plugging a standard USB cable into a small, generic mobile charger.” The company’s high-power-density GaN-on-silicon semiconductors have been developed to help create


ultra-fast, efficient and smaller 45- to 65-watt chargers. The ability of USB type C ports to serve as universal connections for the simultaneous transfer of electrical


power, data and video is leading to tremendous growth. The number of devices with at least one USB type C port is forecasted to multiply from 300 million units in 2016 to nearly five billion by 2021, according to market research firm IHS Markit. Exagan claims it is working to accelerate the adoption of cost-effective GaN-based solutions for the


charger market. The company uses 200mm GaN-on-silicon wafers in its fabrication process, achieving highly cost efficient high-volume manufacturing. Exagan is now sampling its fast, energy-efficient devices to key customers while ramping up production to begin volume shipments of G-FET and G-DRIVE products. www.exagan.com


devices also feature an improved DC current rating of 220A. This enables higher power density, which is especially valuable for safety-critical automotive applications that require dual redundant circuitry. The use of Superjunction technology delivers a higher Avalanche capability and Safe Operating Area for improved performance under fault conditions. LFPAK56 Trench 9 MOSFETs facilitate easy paralleling for high current applications. www.nexperia.com


Diodes Incorporated has announced a line of signal switches, clock generators and clock buffers for PCI Express (PCIe) 4.0 technology applications.Addressing the expanding market for signal routing with different protocols in PCs, servers, embedded applications including artificial intelligence and fast data transfer generally, the PI3DBS16212 and PI3DBS16412 are 1-20Gbps 2-channel and 4-channel 2:1 differential multiplexers/demultiplexers with extremely low loss, reflection, crosstalk and skew.


www.diodes.com


ISOLATED POWER CONVERTERS ELIMINATE NEED FOR COSTLY EMI MITIGATION TECHNIQUES


The latest generation of reinforced isolated power converters has been released by Analog Devices, Inc. (ADI). These devices offer low component-level radiated emissions thus helping systems to meet EN 55022/CISPR 22 Class B Electromagnetic Interference (EMI) standard requirements. The ADuM5020/6020 and ADuM5028/6028 series are said to eliminate the need for costly EMI mitigation techniques at the application level and simplify the EMI certification process reducing design cost and time. Emerging safety-critical applications, such as Electric Vehicle and Hybrid Electric Vehicle (EV/HEV)


automotive battery monitoring and industrial programmable logic controllers (PLC), require compact and dense isolated designs that deliver size and weight savings, strict emissions compliance, and reliable protection from high voltages for people and equipment. Use of these devices can achieve emissions targets on a two layer PCB, which can reduce the solution size by as much as 70%, and decreases the material cost by 30% compared to a four layer board. The company advises this new series of 500mW DC-DC power converters builds upon its iCoupler and isoPower chip-scale transformer technologies to support high temperature operation up to 125ºC and one of the smallest 8-lead form factors. The 16-lead ADuM5020/6020 and the 8-lead ADuM5028/6028 are the first devices in the series. www.analog.com


22 JUNE 2018 | ELECTRONICS / ELECTRONICS


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