PRODUCTS EDITOR’S CHOICE MICROCHIP’S NEW AVB AUDIO ENDPOINT MCU M
icrochip Technology Inc.’s hardware-based audio
endpoint solution for AVB – the LAN9360, is a single chip Ethernet controller with embedded protocols. The device interconnects a vehicles’ infotainment system, including speakers, amplifiers,
microphones, navigation systems, radio tuners and smart headrests with Ethernet AVB. It bridges audio between Ethernet AVB and Inter-IC Sound (I2S), Time Division Multiplexing (TDM) and Pulse Density Modulation (PDM) local audio interfaces. It supports audio
transmission over Ethernet AVB, including generalised Precision Time Protocol gPTP, timestamping, transport protocols and content protection with High-bandwidth Digital Content Protection (HDCP). It also supports secure boot and secure remote updates over Ethernet. Unlike other Ethernet bridging networking solutions requiring System-on-Chip (SoC) microcontrollers (MCUs) plus third- party software stacks, the LAN9360 endpoint device requires no software integration, enabling designers to configure the device simply and quickly to manufacturers’ unique audio and networking requirements.
www.microchip.com
KONTRON SUSIETEC ENABLES HOLISTIC APPROACH TO DIGITAL TRANSFORMATION
Kontron’s SUSiEtec holistic digitalisation solutions give access to IoT/embedded computer hardware, software tools and software development environment. “When it comes to the growing
15TH RELEASE OF THERMAL SIMULATION SOFTWARE, 6SIGMAET
Future Facilities has Released version 15 of its thermal simulation software, 6SigmaET. This latest version incorporates major developments with new features, including enhanced views, optimised liquid cooling and fast GPU radiation calculations. Release 15 offers quick analysis of models with photorealistic graphics, 60 fps model manipulation, and it’s
fast-loading surface temperature plots. The new 6SigmaET also provides one of the fastest GPU radiation calculations currently available, with new
ray tracing technology. And with optimised liquid cooling, engineers can model complex liquid cooled systems efficiently with 6SigmaET currently being the only simulation software to offer a fully integrated connection between the 1D flow network and the 3D model. Additionally, 6SigmaET’s latest CAD Workflow means that engineers can update their model to the latest
iteration by updating CAD, rather than having to rebuild from scratch. While new automation functionalities within 6SigmaCommander means that both model creation and post processing can be done automatically - reducing the amount of overall time spent on projects. Chris Aldham, product manager at 6SigmaET said: “As electronic designs grow more complicated, today’s
engineers require ever more accurate and reliable thermal simulation tools. The latest update to 6SigmaET cements our commitment to creating an intelligent and automated thermal simulation software for electronics, meeting the very latest generation of engineering requirements.”
www.6sigmaet.info
market demands for customer- centricity, scalability and flexibility especially smaller and medium size organisations are facing a lack of experienced resources”, says Bernhard Günthner, EVP IoT Software at Kontron S&T. “Using Kontron´s SUSiEtec solutions for holistic digitalisation our customers benefit from the combination of deep know-how and innovative technology. Our experienced teams are helping them to develop and drive their individual and affordable digitalisation strategy.” He further adds: “Kontron is one of
the only European ECT companies able to comprehensively deliver scalable, secure end-to-end digital transformation solutions from one single source. So our customers can focus on their core business as we take care of their digitalisation.”
https://www.susietec.com
OMRON’S COMPACT MOSFET RELAY WITH HIGH CURRENT CAPACITY
OMRON Electronic Components Europe has launched the G3VM – PSON, a compact MOSFET relay with high current capacity for industrial and test applications. With a high continuous load current, low leakage and small packing, the new relay suits application in data loggers, communication devices and test equipment. This device is now available in three versions in an industry standard PSON
1100
package with load voltages of 30V (G3VM-31WR), 60V (G3VM-61WR) and 100V (G3VM-101WR), offering a continuous load current of 4.5A, 3A and 2A respectively. All feature a low on-resistance, which is 50mOhm – 200mOhm depending on the version. The higher current in a small package of only 3.4 x 2.1 x 1.3mm helps achieve a compact overall board layout. The relay has a high dielectric strength of 500VAC between the input and the output, and a leakage current of 1000nA when open. The terminal shape is designed to support the creation of a good soldering joint despite the small size of the device, and supports easy solder inspection. The G3VM – PSON has an ambient operating temperature of -400 C and is ideal for demanding industrial environments.
http://components.omron.eu
C to 6 FEBRUARY 2021 | ELECTRONICS / ELECTRONICS
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