MANUFACTURING


SIPLACE TX micron from ASMPT combines SMT assembly and die processing


The flexible platform of the SIPLACE TX micron combines the speed of SMT assembly with the complexity of die processing. The new version of the pick-and-place machine has been significantly improved by ASMPT in terms of speed and placement accuracy, as well as transport and processing options. The hybrid system offers electronics manufacturers greater flexibility and thus significant competitive advantages for their Intelligent Factory.


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SiP (system-in-package) combines active and passive electronic components into compact functional groups for objects such as radio modules in smartphones, wireless earphones, or smartwatches. The advanced packaging technology required for this assembles dies, bare semiconductor chips, as well as classic SMT components. The high demand for such modules can only be satisfied with machines that process dies with the same high speed that is common in the SMT world and with the level of precision that is common in die processing. It involves the placement of passive SMD components, which must often be positioned very close to each other, with exceptional precision.


Two worlds and three precision classes in one machine


The SIPLACE TX micron from ASMPT fully meets these tough industrial requirements of the industry. After a further increase in the machine’s precision, three accuracy classes are now available for advanced packaging applications in a single machine: 10, 15 and 20 microns, each with a process stability of 3 sigma. Despite its improved basic accuracy from 25 to 20 microns, the machine achieves a placement speed of 93,000 cph, which is an increase of 14% compared to the previous 20-micron class of the SIPLACE TX micron. With its maximum placement accuracy of 10 microns, the machine can process an unprecedented 62,000 components per hour even in mixed SiP applications. Thanks to its larger vacuum tooling, the SIPLACE TX micron can now process substrates measuring up to 300 by 240 millimeters with an accuracy of 15 microns @ 3. Also new is the high-resolution SST54 circuit board camera with improved lighting performance for


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smaller structures, fiducials, and barcodes. With the Long Board Option, the SIPLACE TX micron can process PCBs measuring up to 590 by 460 millimeters (23.2 by 18.1 inches). Another new feature is an optional multi- purpose conveyor system that allows regular PCBs, PCBs with carriers up to 20.5 mm high or curvatures, as well as J-boats and JEDEC trays to be used as carriers. The customers who manufacture for highly demanding consumers like those in the automobile industry will appreciate the optional level of traceability directly from the tape.


Now compatible with SIPLACE Tray Unit


As an added benefit for fast and uninterrupted production, the SIPLACE TX micron can now be operated with the SIPLACE Tray Unit, which accommodates carriers that can each hold two JEDEC trays. Depending on the size of the components, up to 82 JEDEC trays or 41 wide trays measuring up to 355 by 275 millimeters


DECEMBER/JANUARY 2024 | ELECTRONICS FOR ENGINEERS


fit into the unit. As a special feature, new trays can be added without having to interrupt the production because the magazine is split into a buffer zone for the continuous supply and the main storage area, which can be refilled with new trays.


Proven quality


Unchanged in the new version are established features, such as the cost-saving detection of damaged or unusable components and the high-resolution component vision system with blue light that improves the image contrast for especially fine structures and balls. The SIPLACE TX micron is also certified in accordance with ISO Class 7 cleanroom requirements and Semi S2/S8.


A safe investment


“ASMPT’s product portfolio covers a wide range of areas for processing dies as well as SMT components,” explains Sylvester Demmel, Senior Product Manager at ASMPT.


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