THERMAL MANAGEMENT
Solving the thermal challenge in high-power electronic assemblies
Thermal management plays a hugely important role in the reliability and performance of modern electronic systems.
C
omponents are becoming smaller, more powerful and more densely packed, meaning the amount of heat generated within assemblies continues to rise. If this heat is not effectively controlled, it can lead to reduced efficiency, signal instability, premature component failure and, in safety critical sectors, unacceptable risk. As a result, thermal management is now a fundamental part of electronics engineering from concept through to production.
Heat dissipation in electronic design
At its core, thermal management is about moving heat away from sensitive components and dispersing it safely. This can be achieved through a combination of conduction, convection and radiation, supported by design choices such as PCB material selection, layer stack up, copper distribution, component placement and mechanical integration.
In many applications, especially within defence, aerospace and high reliability industrial electronics, passive thermal solutions must be carefully optimised to perform consistently across wide operating temperature ranges and long service lives. Printed circuit boards themselves are often the first line of defence against overheating. Increasing copper content, using thermal vias, embedding heat spreaders and selecting substrates with improved thermal conductivity can all enhance heat dissipation. However, with power densities continuing to increase, standard PCB approaches may no longer be sufficient on their own. This has driven growing interest in advanced thermal management techniques that integrate more directly into the board structure.
One such approach is copper coin technology.
Copper coin technology in practice Copper coins are solid copper inserts embedded into the PCB to provide a direct, low resistance thermal path from heat generating components to internal planes, heat sinks or chassis interfaces. By bypassing the relatively poor thermal conductivity of standard laminate materials,
copper coins can significantly improve heat transfer and enable higher power operation within compact designs. Despite these benefits, copper coin implementation introduces manufacturing challenges, particularly around solderability, voiding and reflow control.
Contract electronics manufacturer Nemco recently supported a customer in the defence sector evaluating the use of copper coin technology as part of a broader thermal management strategy. The customer had previously experienced issues with voiding and outgassing during their own trials, raising concerns about long-term reliability and compliance. Nemco was engaged to manage a tightly scheduled feasibility programme, with just three months from project kick off to start of volume production.
The trials focused on understanding how copper coin height tolerances and reflow conditions affected solder joint quality. Multiple boards were measured, assembled and carefully profiled through reflow, with full traceability maintained throughout the process. X-ray inspection was then used to assess voiding and confirm compliance with IPC A 610 Class 3 requirements. Of this project, Nemco sales director David Duric said: “Our findings meant we
were able to provide clear, evidence- based recommendations on optimal coin dimensions and process parameters, demonstrating that copper coin technology can be successfully deployed when supported by controlled design and manufacturing practices.”
A holistic approach to thermal management
More broadly, effective thermal management is rarely achieved through a single solution. It requires a complete approach that considers electrical performance, mechanical constraints, manufacturing capability and long- term reliability. It is important for early collaboration between design, process and manufacturing teams so that risks can be identified before production. Electronic systems will continue to change, so robust thermal management will remain a key differentiator between designs that merely function and those that perform reliably in the most demanding environments. By combining proven techniques with emerging technologies such as copper coins, manufacturers such as Nemco can meet increasing thermal demands without compromising quality or compliance.
FEBRUARY 2026 | ELECTRONICS FOR ENGINEERS 21
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