COMMENT
exact timing, amplitude and frequency, while remaining robust to temperature fluctuations, electrical noise and continuous operation.
Off-the-shelf components often struggle to meet these demands, as they typically rely on multiple discrete chips to perform the necessary functions, which increases latency, complicates circuitry and makes it difficult to integrate haptics into compact, space-constrained panels.
Purpose-built chips consolidate waveform generation, signal conditioning, actuator control and power management onto a single silicon die. Consolidating these critical functions onto a single chip allows ASICs to eliminate inter-chip communication delays and synchronisation issues.
It also enables advanced on-chip features. Memory and processing resources can implement sophisticated waveform-shaping algorithms, closed-loop feedback and real-time error compensation. This allows the system to continuously adjust tactile outputs in response to actuator variation, temperature shifts or electrical interference, without compromising precision. Consolidated into sleek digital panels, these systems deliver a new level of tactile
feedback beyond the use of mechanical controls, allowing users to confirm inputs directly through touch. This reduces cognitive load, sharpens reaction times and supports more precise, confident operation. ASICs ensure consistent, reliable performance even in demanding industrial environments with heat, vibration or electrical noise.
ASICs bridge the gap between human intent and machine response, giving digital interfaces a sense of touch that feels natural and immediate.
Swindon Silicon Systems specialises in developing ASICs that help to restore intuitive, high-fidelity touch to modern digital human-machine interfaces. Starting a project, get in touch today.
Get all the latest industry updates in the world of Electronics for Engineers, by reading EFE each month
E NGINEERS LECTRONICS FOR
Do you or a colleague need to receive a regular copy of Electronics For Engineers and the monthly newsletter?
FEBRUARY 2026 | ELECTRONICS FOR ENGINEERS 13
Page 1 |
Page 2 |
Page 3 |
Page 4 |
Page 5 |
Page 6 |
Page 7 |
Page 8 |
Page 9 |
Page 10 |
Page 11 |
Page 12 |
Page 13 |
Page 14 |
Page 15 |
Page 16 |
Page 17 |
Page 18 |
Page 19 |
Page 20 |
Page 21 |
Page 22 |
Page 23 |
Page 24 |
Page 25 |
Page 26 |
Page 27 |
Page 28 |
Page 29 |
Page 30 |
Page 31 |
Page 32 |
Page 33 |
Page 34 |
Page 35 |
Page 36 |
Page 37 |
Page 38 |
Page 39 |
Page 40 |
Page 41 |
Page 42 |
Page 43 |
Page 44 |
Page 45 |
Page 46 |
Page 47 |
Page 48 |
Page 49 |
Page 50