INTERCONNECTION


 


4. Vibration and shock


Intense vibration during launch can compromise connector integrity. Side-to-side (lateral axis) and forward-to-backward (thrust axis) motions can lead to misalignment or breakage in connector contact areas. Shocks generated at launch when the payload separates from the launch vehicle can loosen connectors and create fatigue points.


Strategies for mitigating LEO environmental effects


Hermetic sealing is recommended to mitigate many of these risks. Hermetic sealing protects internal components from the vacuum of space and prevents internal gases from escaping. It also prevents air, gas and moisture from penetrating the assembly. To help ensure design success, there are several standards relevant to space applications: • ASTM E595 outgassing test method for materials in vacuum environments measures total mass loss (TML) and collected volatile condensable materials (CVCM) at 125°C and 25°C, respectively.  


•


 for electrical, electronic and


• •


electromechanical (EEE) parts selection,  establishes reliability levels for EEE parts based on mission needs. 


International Space Station (ISS) external contamination control requirements.


 stability requirements for polymeric materials.


Connectors should be selected per these standards to ensure they meet the rigorous requirements of space missions. Technology Readiness Levels (TRL),  standardised method for estimating the maturity of technologies on a scale from 1 (basic principles observed and reported) to 9  component selection for several reasons: • Risk reduction: Higher-TRL components have been proven in relevant environments or actual space missions.


• Cost management: Using higher-TRL components can reduce development and testing requirements.


• Progress tracking: TRL allows monitoring of technology development from  planning and decision-making during spacecraft development.


• Common language: TRLs facilitate discussion of maturity across different space technologies. • Integration ease: Higher-TRL components are generally easier to integrate into existing systems, 


Connector solutions for LEO To address the design requirements of LEO applications, Cinch Connectivity Solutions offers its Cinch Space Mission Solutions portfolio of connectors. These are designed to meet the challenges related to LEO satellites such as CubeSats and NanoSats, which are tightly constrained in size and weight.


Stacking connector jumpers Cinch’s CIN::APSE stacking connector jumpers provide solderless, high-density custom interconnects for applications  component-to-board connections in LEO satellites. Key features include: • coplanar and right-angle board-to-  satellite design and layout;


• combination of RF, power, signal and high-speed data in a 1-millimeter (mm) package;


•


 proven reliability;


• and proven performance under extreme mechanical shock, vibrations and thermal conditions.


  compresses to join a stacking connector mounted on a rigid pc board.   


  


Space-screened micro-D connectors


For miniaturised airborne electronics and data processing equipment, and where shorter signal paths are needed in compact satellite designs, Cinch provides the space-screened Dura-Con micro-D connectors. Notable features include twist pin contacts and machined sockets for durable seven points of  to micro-D connectors), nickel plating and  wires. The DCCM25SCBRPN-X2S 25-pin micro-D receptacle is a good example (Figure 3). This receptacle has two rows with a pitch of   amperes (A) and exceeds the LEO outgassing  percent CVCM.


Attenuators   space applications. They meet ASTM E595 and MIL-DTL-3993 outgassing standards     attenuator features DC to 18 gigahertz (GHz) performance, 2-watt average power handling  temperature range of -55 to +125°C.


APRIL 2025 | ELECTRONICS FOR ENGINEERS 7


  


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