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ENGINEERS LECTRONICS FOR


April 2025


ENGINEERS LECTRONICS FOR


April 2025 In this issue


In our April issue, we have featured a number of exciting articles from companies that we love working with to produce quality content for you, including Digikey, Belden, OMC, Swindon Silicon Systems and Analog Devices.


Featuring:


Smart Tech and IOT Optoelectronics Interconnection


Wearable Tech and Biometrics 1 E4E Cover V1.indd 1 22/04/2025 14:27


One of our key features this month was sensors, where our clients have discussed how advanced sensor technology, especially custom integrated circuits (ASICs), enhances safety and regulatory compliance in food processing. They touch on how ASIC-based sensors improve accuracy, responsiveness and  of which are critical for preventing contamination, spoilage and costly product recalls in the industry.


Contents Editor’s Comment & News


4. A new generation of robots and drones are making our world safer and protecting lives


Features


Interconnection 6. Selecting space-grade connectors for LEO satellite applications


8. Heilind Electronics’ strategic interconnect distribution model across high-reliability markets in Europe


Manufacturing 10. The use of thermosetting and thermoplastic polymers in electronic applications


14. Keeping AGVs on track: The critical role of connectivity


Optoelectronics 16. 


Sensors 20. Solving climate change through collaboration


22. Current transducers from Danisense again selected by CERN


Smart Tech and IOT 28. Security and privacy: can an OEM protect one without protecting the other?


30. Generative AI, edge computing and data fabric architectures are shaping a new era of smart technology and interconnected systems


Thermal Management and EMC 32. Chilled water solutions: the backbone of liquid cooling for AI and high-density data centres


34. Water versus convection cooling: what is the difference?


Wearable Tech and Biometrics 38. How to accelerate peripheral monitoring in low power wearables with DMA


42. How to manage size and power constraints when implementing AI/ML in wearable audio devices


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Electronics For Engineers


APRIL 2025 | ELECTRONICS FOR ENGINEERS


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