THERMAL MANAGEMENT AND EMC
How to achieve reliable miniaturisation with customised cooling concepts
Thomas Windeck, head of sales, CTX Thermal Solutions N
ever change a running system; a wise saying in the IT world that is also followed by other disciplines. Nevertheless, it is often worthwhile to challenge existing concepts, as shown by the example of power electronics. While power components are becoming ever smaller and more powerful, standard cooling concepts are still widely used. Suitably dimensioned thermal management solutions life of electronic components, together with increased cost-effectiveness.
Important aspects of cooling concepts
Four factors are crucial for a cooling solution. heat sink should have a lightweight design to reduce the load on the component. Thirdly, it must be as small as possible. The last factor to consider is the price-performance ratio. Based on these factors, as well as the material, design and manufacturing method, heat sink manufacturers like CTX create high-quality heat sinks with added value.
Now is the time to change a running system
For example, the temperature of a sample system needs to be ten degrees lower. This is possible without changing the size of the component. Thermal management in this sample component is based on the classic of power electronics. Its design consists of a base plate that is connected to several closely surface for heat transfer.
Now we have to determine how much heat is dissipated by the base plate. At which point design that makes full use of the base thickness example, changing the base thickness from 11 to 14 millimeters improves cooling by about 1.7 degrees.
The second point to consider is the number quantities. They can be designed for the exact
Figure 2: Forming processes such as cold forging can be used to manufacture miniature heat sinks,
for example
cooling requirement by means of a forming tool. This reduces material by 20 percent compared to standard components. In our size of the base plate. The overall temperature reduction is now three degrees.
installation space
Further potential for optimisation is possible by looking at the heat generation of the
cooling concept of a heat pipe can be used consists of a closed copper tube system with an internal capillary structure. In this system, a coolant absorbs large amounts of heat at the hot spot, then conveys it to the heat sink, where it is discharged in the form of condensation. to 400 W/mK, it has higher thermal conductivity than aluminum at 180 W/mK. Since it is much heavier and more expensive, however, it is mostly used as a coating, plate or core. In our example, the combination of aluminium achieves the target value; the cooling capacity of the thermal concept is now 9.9 degrees below the starting temperature.
How customised cooling solutions meet the demands of miniaturisation
Standard heat sinks are good in all applications potential cannot be fully utilised. With solutions that are specially designed for the application, CTX can achieve the same heat transfer while reducing the weight and size. As miniaturisation progresses, these solutions will continue to gain in importance.
www.ctx.eu APRIL 2025 | ELECTRONICS FOR ENGINEERS 35
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